High Throughput Low Stress Air Jetting Carrier Release for RDL-First Fan-Out Wafer-Level-Packaging

Tang, Hao; Shi, Gary; He, Raphael; Chang, Hsiang-Hung; Yang, Shang-Shyng; Zhang, Wei; Nguyen, M.N.

doi:10.1109/ectc.2017.338

Cited by 4 publications

(3 citation statements)

References 4 publications

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“…The process, AirDebond™ and Z-coat series material were first reported by Hao Tang from Micro Materials Inc. (MMI) in 2016 [41] and was developed for wafers with flat surfaces, high topography or bumps. The process was applied to FOWLP containing the processing of RDL passivation layer, sputtering Ti/Cu metal layer and wafer level molding [42]. Z-coat 211, a polyimide-based adhesive, is adopted in this process, which shows low peel adhesion on silicon and glass, high thermostability, chemical resistivity, good shear strength and thermal stability.…”

Section: Mechanical Peel-offmentioning

confidence: 99%

“…; as the application scenarios changed, materials and techniques for debonding using solvents (e.g., Zero Newton temporary debonding system from TOK [33,34]), mechanical forces (e.g., BrewerBOND ® 305) [35] or lasers (e.g., 3M WSS [36], HD-3007 from HDMS [23], BrewerBOND ® 701 [37][38][39]) to release were developed. Special technologies such as ZoneBOND ® [40] and air-jetting were developed [41,42]. In addition, hydrogenated amorphous silicon (a:Si-H) [22,43] and various polymers, such as polyelec-trolyte [44], iCVD polyglycidylmethacrylate (PGMA) [45] and polydimethylglutarimide (PMGI) [46], have also been used as temporary bonding materials.…”

Section: Introductionmentioning

confidence: 99%

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Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

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Section: Mechanical Peel-offmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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“…To provide mechanical support, typical polymer layers include acrylics, thermoplastics, polyimides, and elastomers [203]. Nowadays, polymers that can resist temperatures of up to 250-300 • C are occupied in the market, and efforts are currently being made to produce materials that can tolerate even higher temperatures [204][205][206][207].…”

Section: Dielectric Bondingmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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