Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Abstract

Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

Research of Vertical via Based on Silicon, Ceramic and Glass

“…In this technology, the wafer is temporarily bonded to a hard slide to provide sufficient mechanical support. After the processing and interconnection are completed, the TSV silicon transfer substrate is peeled off from the temporary slide without loss [ 42 ]. The process flow of the TBDB is shown in Figure 14 .…”