Abstract:Katahira z-L-L, Aoba-ku, Sendai 980, Japan We propose a microchannel fin package utilizing a passivation layer of AIN as the heat spreader and a microchannel fin as the efficient heat removal method. AIN film has high thermal conductivity and compatibility with the thermal expansion coefficient of Si. A microchannel fin has 4 fold 1-00 lines of 50pm x 250pm channels on a Lcm2 chip and is cooled by water coolant. Thermal capability of our new package was evaluated by the simulator of dynamic thermal analysis. W… Show more
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