bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages

Shaukatullah, H.

doi:10.1109/stherm.1999.762454

Cited by 6 publications

(2 citation statements)

References 119 publications

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“…TIM1 is the thermal interface between the die and the heat spreader and TIM2 is the thermal interface between the heat spreader and the heat sink. Typical system cooling technologies have been widely covered in the literature (Sauciuc et al 2005;Chu et al 2004;Shaukatullah 1999). For a product with non-uniform power maps and local regions of higher power, package thermal resistance can dominate the overall stack thermal resistance.…”

Section: Multi-chip Packagesmentioning

confidence: 99%

Thermal Sensors

2015

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Section: Multi-chip Packagesmentioning

confidence: 99%

Thermal Sensors

2015

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“…In addition, local power densities are more difficult to be managed, thus making thermal management more challenging. Many technologies [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] ranging from air cooling to refrigeration have been proposed for CPU cooling in the last years but their cooling significance was not well quantified in relationship to peak power density cooling, therefore there is a need to focus electronics cooling research and development on the most promising and cost effective technologies. As well known, the primary objective of thermal management in microelectronics applications is to keep the die junction temperature (T j ) below acceptable limits in order to ensure device performance and reliability.…”

Section: Introductionmentioning

confidence: 99%

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Sauciuc

Prasher

Chang

et al. 2005

Advances in Electronic Packaging, Parts A, B, and C

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Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and development focus for future non air-cooling technologies. This paper presents the thermal performance capability for enabling and package based cooling technologies using a range of “reasonable” boundary conditions. In the enabling area a few key main building blocks are considered: air cooling, high conductivity materials, liquid cooling (single and two-phase), thermoelectric modules integrated with heat pipes/vapor chambers, refrigeration based devices and the thermal interface materials performance. For package based technologies we present only the microchannel building block (cold plate in contact with the back-side of the die). It will be shown that as the hot spot density factor increases, package based cooling technologies should be considered for more significant cooling improvements. In addition to thermal performance, a summary of the key technical challenges are presented in the paper. This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

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