Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195)
DOI: 10.1109/stherm.1998.660404
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Bibliography of air cooled heat sinks for thermal enhancement of electronic packages

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Cited by 7 publications
(1 citation statement)
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“…For pin fins, geometric variations have primarily dealt with the cross-sectional shapes of the pins (e.g., ellipses [6] and diamonds [7]) and the inclinations of the pins with respect to the heat sink base plates [8]. A wide-ranging compilation of fin literature is available in [9].…”
Section: Introductionmentioning
confidence: 99%
“…For pin fins, geometric variations have primarily dealt with the cross-sectional shapes of the pins (e.g., ellipses [6] and diamonds [7]) and the inclinations of the pins with respect to the heat sink base plates [8]. A wide-ranging compilation of fin literature is available in [9].…”
Section: Introductionmentioning
confidence: 99%