High‐performance hyperbranched poly(phenylene oxide) modified bismaleimide resin with high thermal stability, low dielectric constant and loss

Huang, Pingzhen; Gu, Aijuan; Liang, Guozheng; Yuan, Li

doi:10.1002/app.33172

Cited by 12 publications

(7 citation statements)

References 38 publications

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“…There are several approaches for decreasing ε and dielectric loss of a polymer. One approach is the blending of BMIs with other resins or thermoplastics that inherently have excellent dielectric properties; these include cyanate ester, poly(ether imide), and poly(phenylene oxide) . However, the thermal resistance or processing performance of BMIs is usually sacrificed with this method .…”

Section: Introductionmentioning

confidence: 99%

Fluorinated bismaleimide resin with good processability, high toughness, and outstanding dielectric properties

Guo

Han

Liu

et al. 2015

J of Applied Polymer Sci

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In this study, novel fluorinated bismaleimide (BMI) resins were prepared by the copolymerization of 2,2 0 -bis[4-(4-maleimidephenoxy)phenyl]hexafluoropropane (6FBMP) and diallyl hexafluorobisphenol A (6FDABPA) to enhance their dielectric properties. The dielectric properties of the resins were investigated in the frequency range 7-18 GHz through a cavity method. Through the incorporation of a hexafluoroisopropyl group with the polymer chain, the dielectric constant (e) was effectively decreased because of the small dipole and the low polarizability of the carbon-fluorine (CAF) bonds. The 6FBMP/6FDABPA resin possessed excellent dielectric properties, with e being 2.88 and the dielectric loss being 0.009 at 10 GHz and 258C. In comparison with the 4,4 0 -bismaleimidodiphenylmethane (BDM)/2,2 0 -diallyl bisphenol A (DABPA) resin, the glass-transition temperature (T g ) of 6FBMP/6FDABPA decreased. The flexible ether group in the long chain of 6FBMP was considered to disrupt chain packing and cause a decreased crosslinking density and a lower T g . 6FBMP/6FDABPA showed a similar thermal decomposition temperature and good thermal properties like the BDM/DABPA resin, whereas the impact strength of the 6FBMP/6FDABPA resin was almost 1.6 times higher than that of the BDM/DABPA resin.

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Section: Introductionmentioning

confidence: 99%

Fluorinated bismaleimide resin with good processability, high toughness, and outstanding dielectric properties

Guo

Han

Liu

et al. 2015

J of Applied Polymer Sci

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“…In our previous studies, 32,33 HPPO was prepared from 4-bromo-49,499-dihydroxyltriphenylmethane by the Ullmann reaction using CuCl as the catalyst. The phenolic terminated HPPOs can be easily modified and used in epoxy resins, 34 bismaleimide resins, 35 and cyanate ester resins. 36 In another work of ours, 37 the Ullmann reaction was replaced by the S N Ar reaction, and HPPO was synthesized using 4-fluoro-49,499-dihydroxyl triphenyl methane as an AB 2 monomer.…”

Section: Introductionmentioning

confidence: 99%

A novel fluoro-terminated hyperbranched poly(phenylene oxide) (FHPPO): synthesis, characterization, and application in low-k epoxy materials

et al. 2013

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“…Secondly, during the microcrack propagating, crack pinning, or blunting effects of PPOMCs inside the matrix and the debonding of PPOMCs from matrix can absorb more energy [20], which can stabilize the crack and enhance the mechanical property. Thirdly, PPO can be served as toughener to improve the toughness of polymer matrix [21][22][23]; therefore, the PPO compositioncontaining PPOMCs embedded in polymer matrix can toughen BDM/BA matrix. matrix, consequently, the fracture toughness of BDM/BA matrix decreases [24].…”

Section: Resultsmentioning

confidence: 99%

High performance self‐healing bismaleimide/diallylbisphenol a/poly(phenylene oxide) microcapsules composites with low temperature processability

Lin

Yuan

et al. 2013

Polymer Composites

Self Cite

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Novel high performance self‐healing 4,4′‐bismaleimidodiphenylmethane (BDM)/diallylbisphenol A(BA)/poly(phenylene oxide) microcapsules filled with epoxy resin (PPOMCs) systems with low temperature processability were developed. The effects of PPOMCs on the reactivity of BDM/BA resin system were investigated; the properties of cured BDM/BA/PPOMCs systems such as fracture toughness, dynamic mechanical property, dielectric property, and self‐healing ability were discussed. The morphologies of the cured resin systems were characterized using scanning electronic microscope and light microscopy. Results reveal that the addition of PPOMCs can catalyze the polymerization reaction of BDM/BA resins. BDM/BA systems with appropriate PPOMCs content cured at low temperature possess excellent fracture toughness, high glass transition temperature (Tg), and low dielectric property. The self‐healing ability of BDM/BA can be realized by the introduction of PPOMCs owing to the polymerization of the released core materials from PPOMCs. The self‐healing efficiency of healed BDM/BA/PPOMCs systems can be influenced by the size and content of PPOMCs and the contact areas between the crack surfaces. © 2013 Society of Plastics Engineers

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High‐performance hyperbranched poly(phenylene oxide) modified bismaleimide resin with high thermal stability, low dielectric constant and loss

Cited by 12 publications

References 38 publications

Fluorinated bismaleimide resin with good processability, high toughness, and outstanding dielectric properties

Fluorinated bismaleimide resin with good processability, high toughness, and outstanding dielectric properties

A novel fluoro-terminated hyperbranched poly(phenylene oxide) (FHPPO): synthesis, characterization, and application in low-k epoxy materials

High performance self‐healing bismaleimide/diallylbisphenol a/poly(phenylene oxide) microcapsules composites with low temperature processability

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