2009
DOI: 10.1063/1.3090034
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High mobility holes in a strained Ge quantum well grown on a thin and relaxed Si0.4Ge0.6/LT-Si0.4Ge0.6/Si(001) virtual substrate

Abstract: Epitaxial growth of a compressively strained Ge quantum well (QW) on an ultrathin, 345 nm thick, Si0.4Ge0.6/LT-Si0.4Ge0.6/Si(001) virtual substrate (VS) has been demonstrated. The VS, grown with a low temperature Si0.4Ge0.6 seed layer on a Si(001) substrate, is found to be fully relaxed and the Ge QW is fully strained. The temperature dependence of Hall mobility and carrier density clearly indicates a two-dimensional hole gas in the Ge QW. At room temperature, which is more relevant for electronic devices appl… Show more

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Cited by 18 publications
(6 citation statements)
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“…However, relaxed Ge does not out-perform the current stateof-the-art uni-axially strained Si. Considerably higher hole velocities are reported for uni-axially and bi-axially compressively strained Ge [3][4][5][6][7][8][9]. The fabrication of uni-axially compressively strained Ge requires the implementation of embedded GeSn with a substitutional Sn content far above the solubility limit of 0.5-1% [10].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…However, relaxed Ge does not out-perform the current stateof-the-art uni-axially strained Si. Considerably higher hole velocities are reported for uni-axially and bi-axially compressively strained Ge [3][4][5][6][7][8][9]. The fabrication of uni-axially compressively strained Ge requires the implementation of embedded GeSn with a substitutional Sn content far above the solubility limit of 0.5-1% [10].…”
Section: Introductionmentioning
confidence: 99%
“…The fabrication of uni-axially compressively strained Ge requires the implementation of embedded GeSn with a substitutional Sn content far above the solubility limit of 0.5-1% [10]. This complication explains the high research interest in bi-axially strained Ge, grown on top of SiGe strain relaxed buffers (SRBs) [5][6][7][8][9]11,12]. Important parameters from device integration point of view are, amongst others, the surface smoothness, the material quality (crystallinity), and the threading dislocation density (TDD).…”
Section: Introductionmentioning
confidence: 99%
“…Even though high mobility 2DHGs have been achieved [18][19][20][21][22], Ge 2DHG based MODFETs with high mobility operating at cryogenic temperatures have, to the best of our knowledge, not been investigated up to now. Operation of a ptype Ge channel MODFET has been reported at an operating temperature of T = 77 K [23] and 2DHG MOSFETs with Ge channels have also been investigated [24].…”
Section: Introductionmentioning
confidence: 99%
“…However, relaxed Ge does not outperform the current state of the art uni-axially strained Si. Considerably higher hole velocities are reported for uni-axially and bi-axially compressively strained Ge [2][3][4][5][6][7]. The fabrication of uni-axially strained Ge requires the implementation of embedded GeSn with a substitutional Sn content far above the solubility limit of 0.5 -1%.…”
Section: Introductionmentioning
confidence: 99%