Articles you may be interested inThree-dimensional electron-beam lithography using an all-dry resist process Si nanostructures fabricated by electron beam lithography combined with image reversal process using electron cyclotron resonance plasma oxidation A technology for micro/nanostructuring of surfaces based on one-step direct electron-beam lithography, plasma-chemical etching, and electrochemical deposition is developed. The key operation for three-dimensional ͑3D͒ design is 3D dose correction. It allows one to create structures in organic resist on a substrate with a predefined profile with vertical sizes in the range of 50 nm-5 m and with 50-1 mm dimensions in the lateral direction. Metal replicas were created by electrochemical deposition. The replicas were used then as a stamp for fast transferring of the relief into a soft material ͑polymer͒. We expect the application of this process in optoelectronics, optical processing, creation of zone plates, and other diffractive optical elements ͑calculated holograms͒.