1984
DOI: 10.1016/0022-0248(84)90391-9
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Growth of GaAs on Si by MOVCD

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Cited by 197 publications
(40 citation statements)
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“…8,14,15 Before the growth, an annealing (1 min-10 min) at high temperature (800 • C-950 • C) under H 2 is added to promote structuring of the 2 × 1 surface. [17][18][19][20][21][22][23][24][25][26][27] The Si surface presents mainly double steps (Figure 1(b)) with a width of about 100 nm, and few monoatomic islands remains at the step edges (not clearly visible from the AFM image).…”
Section: -2mentioning
confidence: 99%
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“…8,14,15 Before the growth, an annealing (1 min-10 min) at high temperature (800 • C-950 • C) under H 2 is added to promote structuring of the 2 × 1 surface. [17][18][19][20][21][22][23][24][25][26][27] The Si surface presents mainly double steps (Figure 1(b)) with a width of about 100 nm, and few monoatomic islands remains at the step edges (not clearly visible from the AFM image).…”
Section: -2mentioning
confidence: 99%
“…Hageman et al reported a value of µ e ∼ 5000 cm 2 /V s for homoepitaxial GaAs layer with a comparable doping level. 37 In the eighties, Akiyama et al 14,38 have grown GaAs directly on Si(001) substrates. They claimed that they were able to grow APB-free materials with film thickness about 3 µm and that they obtained a mobility of 5200 cm 2 /V s. This mobility decreases to 2000 cm 2 /V s in presence of APB showing their detrimental effect.…”
Section: -2mentioning
confidence: 99%
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“…), if a thick epitaxial GaAs layer is fully relaxed during growth at a high temperature it cracks during cooling [1,4]. The solution is to use a thin epitaxial layer, since there is a critical thickness for cracking of epitaxial layers [5].…”
Section: Introductionmentioning
confidence: 99%
“…Perhaps the most widely studied system is GaAs on Si [1], which was the subject of intense work in the 1980s [2] but failed to become commercially viable. There are two main problems in this materials system; thermal expansion mismatch [3], and high TD density .…”
Section: Introductionmentioning
confidence: 99%