“…[26][27][28][29] To date, a variety of processing techniques including rf sputtering, pulsed laser deposition (PLD), and sol-gel have been successfully used to deposit PZT films on group III nitride semiconductors. 18,23,[25][26][27][28][29] However, for commercial-scale production of device-quality PZT thin films on GaN, a manufacturable metalorganic chemical vapor deposition (MOCVD) process must be developed, a technique that offers a number of advantages, including excellent film uniformity on large substrates, good compositional control, high deposition rate, and conformal deposition on three-dimensional (3D) structures. 30,31 Although there have been numerous reports on the deposition of PZT by MOCVD, the substrates are typically pure metals (e.g., Pt, Ru, and Ir) or conducting metal oxides [e.g., IrO 2 , RuO 2 , (La, Sr) CoO 3 , and SrRuO 3 ].…”