Fully embedded board-level guided-wave optoelectronic interconnects

Chen, R.T.; Lin, Lei; Choi, Chulchae; Liu, Y.J.; Bihari, Bipin; Wu, Linghui; Tang, Suning; Wickman, Randy W.; Picor, B.; Hibb-Brenner, M.K.; Bristow, Julian P. G.; Liu, Y.S.

doi:10.1109/5.867692

Cited by 186 publications

(69 citation statements)

References 43 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Recent reports by both academia and industry have predicted that the electrical interconnect technology will be replaced by optical interconnect technologies for high performance computing in the next decade [1] [5] [10]. Different approaches for signal transmission and distribution have recently been reported, including, polymer waveguides [11]- [12], fiber ribbons [13]- [14], fiber image guides [15]- [16], and free space optical interconnects using lenses and mirror systems [17]- [21].…”

Section: Introductionmentioning

confidence: 99%

A novel reconfigurable optical interconnect architecture using an Opto-VLSI processor and a 4-f imaging system

Shen¹,

Xiao²,

Alameh³

2009

Opt. Express

View full text Add to dashboard Cite

A novel reconfigurable optical interconnect architecture for onboard high-speed data transmission is proposed and experimentally demonstrated. The interconnect architecture is based on the use of an Opto-VLSI processor in conjunction with a 4-f imaging system to achieve reconfigurable chip-to-chip or board-to-board data communications. By reconfiguring the phase hologram of an Opto-VLSI processor, optical data generated by a vertical Cavity Surface Emitting Laser (VCSEL) associated to a chip (or a board) is arbitrarily steered to the photodetector associated to another chip (or another board). Experimental results show that the optical interconnect losses range from 5.8dB to 9.6dB, and that the maximum crosstalk level is below −36dB. The proposed architecture is tested for highspeed data transmission, and measured eye diagrams display good eye opening for data rate of up to 10Gb/s.

show abstract

Section: Introductionmentioning

confidence: 99%

A novel reconfigurable optical interconnect architecture using an Opto-VLSI processor and a 4-f imaging system

Shen¹,

Xiao²,

Alameh³

2009

Opt. Express

View full text Add to dashboard Cite

show abstract

“…Optical beams can pass through one another in free space without any cross-talk so offer an attractive alternative provided the cost of the optical interconnections can be minimized. The lowest cost approach is to form polymer waveguides with a higher refractive index polymer core surrounded by a lower refractive index polymer cladding, [1][2][3] fabricated on multi-layer optical PCBs (OPCBs) which has the advantage that the PCB copper tracks can carry power and low data rate control signals to line cards.…”

Section: T Introductionmentioning

confidence: 99%

Photolithographically manufactured acrylate polymer multimode optical waveguide loss design rules

Wang¹,

Selviah²,

Papakonstantinou

et al. 2008

2008 2nd Electronics Systemintegration Technology Conference

View full text Add to dashboard Cite

This paper describes how design rules are established for photolithographically manufactured acrylate polymer optical multimode waveguide components by optical experimental measurements made on the manufactured waveguide component. The loss of individual waveguide components, such as straight sections, 90°bends, crossings, tapers and tapered bends must be known so that the combined loss of a cascade of such elements can be found to determine whether the interconnection's optical power budget is sufficient to achieve a good bit error rate. However, the loss depends on several factors: the materials: the polymer used for the core and for the cladding, the fabrication technique: e.g. the photolithographic procedure and the precise temperature baking regime used, and the measurement technique: the optical source lateral size and angular divergence and precise position relative to the entrance of the waveguide, the output detector lateral size, its angular acceptance angle (if any) and its precise position relative to the exit of the waveguide. The experiments reported on photolithographically manufactured acrylate polymer multimode waveguide were performed at room temperature. A new technique for measure the transmitted power at waveguide crossings is reported for the first time.

show abstract

“…Optics is a potential alternative route to circumvent the underlying problems of galvanic interconnects and is also said to have the potential to continue to scale with future generations of silicon integrated circuits [2]. Optical interconnects based on low-loss waveguides integrated on a printed circuit board (PCB) are a promising solution to overcome the interconnect bottlenecks while still relying on standard board technology [3], [4]. However, one of the most critical problems that remains unsolved is the coupling of light in and out of the optical guiding plane.…”

mentioning

confidence: 99%

Discrete Out-of-Plane Coupling Components for Printed Circuit Board-Level Optical Interconnections

Erps

Hendrickx

Daele

et al. 2007

IEEE Photon. Technol. Lett.

View full text Add to dashboard Cite

Abstract-We propose discrete out-of-plane coupling components as a versatile alternative to current approaches used to couple light in and out of the propagation plane in waveguide-based printed circuit board (PCB)-level optical interconnections. The out-of-plane couplers feature a 45 micromirror and are fabricated using deep proton writing as a rapid prototyping technology. Their fabrication is compatible with replication techniques and shows all the potential of low-cost mass fabrication. In a first configuration, we use the component in a fiber-to-fiber coupling scheme. Coupling losses as small as 0.77 dB were achieved. In a second configuration, the out-of-plane coupler is plugged into a laser ablated cavity in optical waveguides integrated on a PCB. Here a total link loss between out-of-plane fiber and in-plane fiber of 3.00 dB was achieved when using it at the transmitter side and 5.69 dB when using it at the receiver side.

show abstract

Fully embedded board-level guided-wave optoelectronic interconnects

Cited by 186 publications

References 43 publications

A novel reconfigurable optical interconnect architecture using an Opto-VLSI processor and a 4-f imaging system

A novel reconfigurable optical interconnect architecture using an Opto-VLSI processor and a 4-f imaging system

Photolithographically manufactured acrylate polymer multimode optical waveguide loss design rules

Discrete Out-of-Plane Coupling Components for Printed Circuit Board-Level Optical Interconnections

Contact Info

Product

Resources

About