The
migration barriers and formation energies of the silicon interstitials
in an amorphous-SiO2/Si (a-SiO2/Si) interface
are investigated in this work. The migration dynamics and energy profiles
of the interstitials in the sublayers and the a-SiO2/Si
interface are compared using the CI-NEB method. The results indicate
that the neutral interstitial defects may migrate into a-SiO2/Si interface via several low-barrier channels, and get trapped at
the interface because of the high energy barrier of the reverse migration.
In addition, the formation energies and the charge transition levels
of the interstitial defects at the a-SiO2/Si interface
are also calculated with sophisticated corrections. The classical
electrostatic calculation based on the finite element method is introduced
to correct the long-range Coulomb interactions between the charged
defect and its periodic images. The formation energy of the neutral
interstitial defect shows dependence on the layer depth beneath the
interface due to the unevenly distributed strain. The neutral interstitials
on the H and split-⟨110⟩ sites are close in energy and
are 0.2–1.3 eV higher than those on the split-⟨111⟩.
Besides, the tetrahedral site is the most stable configuration in
the double-positive charge state. In fact, the stable site for the
interstitial silicon in the a-SiO2/Si interface depends
on the relative position of the Fermi level and the interfacial strain.