Flip-chip package with a heat spreader for high power dissipation LSI chips

Ando, H.; Kikuchi, Hiroshi; Satô, Toshihiko

doi:10.1109/ectc.1999.776176

Cited by 5 publications

(3 citation statements)

References 4 publications

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“…Mounting of an additional heat sink results in two high resistance interfaces which can negate the heat spreading benefits of the lid if not properly designed. The advantages and disadvantages of using a lid in first level packaging are summarized below: Advantages Previous studies analyzing thermal performance benefits of lids and heat spreaders in flip chip packaging are numerous, including [1][2][3]. Most of the studies analyze thermal enhancement of an air-cooled lidded vs. lidless package without additional cooling devices.…”

Section: Introductionmentioning

confidence: 97%

Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks

Wakil

2006

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 97%

Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks

Wakil

2006

Microelectronics Reliability

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“…[4] An aluminum nitride (AlN) large heat spreader 45 mm square and 3 mm thick is set on a BGA with 359 pins. In this package, solder ball collapse can be avoided using support balls, even with heavy heat spreaders.…”

Section: Example Of Support Ball Methodsmentioning

confidence: 99%

Shape Control of Electronic Devices by Soldering

Kikuchi

Nakazato

Tanaka

et al. 2009

Transactions of The Japan Institute of Electronics Packaging

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The authors investigated shape-control technology for electronic devices using the material characteristics of solder.Specifically, the authors developed and put into practical use the following processes and structures: (1) A "Solder bump transfer process" for reducing variation in the solder bump heights. (2) A "Support ball structure", by which high-meltingpoint solder spacers are set on the four corners of a BGA to control the heights of solder balls. (3) A "Solder pouring process", which allows voidless soldering with molten solder poured into metallized parts on electronic devices. We found that the support ball method is effective for heavy BGA structure packages used in high-speed communication. A highquality hermetic sealing package was realized by application of the solder pouring method.

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“…Meanwhile, on mechanical testing perspective (shock and vibration), the rigid IHS package has more tendencies on causing solder joint cracking compare to non-IHS package. On the other hand, Ando et al [6] discovered that large heat spreader on die back side raised the shearing strain on FC bumps to about 1.3x that of a package without heat spreader. However, the BGA SJR performances were not further discussed or validated.…”

Section: Introductionmentioning

confidence: 99%

Solder Joint Reliability (SJR) Study of Integrated Heat Spreader (IHS) Packages

Wong

Loh

Ong

et al. 2006

2006 International Conference on Electronic Materials and Packaging

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This paper discusses the SJR performance and characteristic study for IHS package technology. Limited industry literature for design reference is the key motivator of this IHS base SJR evaluation on various stresses. Both experimental and simulation studies were performed to identify the critical reliability factors impacting the SJR in static compressive, mechanical shock and transient bend stresses. The critical SJR factors on thermo-mechanical fatigue included solder systems, types of preload and board thickness design were investigated. The impacts of ball pitches, board thicknesses and ball attach process in shock loading will be discussed. Furthermore, the sensitivities contributed by ball pitches, board thicknesses and trace orientation design on transient bend were evaluated as well. Beside, the performance trends and failure modes were analyzed to gather better understanding especially on its driving mechanism. As a summary, this paper presents and documents the key influence factors in SJR for electronic package design in IHS configuration.

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Flip-chip package with a heat spreader for high power dissipation LSI chips

Cited by 5 publications

References 4 publications

Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks

Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks

Shape Control of Electronic Devices by Soldering

Solder Joint Reliability (SJR) Study of Integrated Heat Spreader (IHS) Packages

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