Abstract:The authors investigated shape-control technology for electronic devices using the material characteristics of solder.Specifically, the authors developed and put into practical use the following processes and structures: (1) A "Solder bump transfer process" for reducing variation in the solder bump heights. (2) A "Support ball structure", by which high-meltingpoint solder spacers are set on the four corners of a BGA to control the heights of solder balls. (3) A "Solder pouring process", which allows voidless s… Show more
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.