Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks

Wakil, J.

doi:10.1016/j.microrel.2005.01.007

Cited by 21 publications

(1 citation statement)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The literature indicates that bare die packages can produce thermal improvements when the external heat sink has a highly conductive base and a low resistance TIM II material. Wakil [1] reported up to a 20% reduction in Theta ja for the bare die case compared to a 0.5mm thick lid mounted to a 50mm x 50mm x 23mm aluminum heat sink. When the 0.5mm lid was replaced with a 2.0mm copper lid, the lidded thermal resistance was lower compared to the bare die case.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance of FC<sup>M</sup>BGA: Exposed molded die compared to lidded package

Galloway

Kanuparthi

Wan

2011

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

View full text Add to dashboard Cite

Thermal resistance data were collected using two different style flip chip ball grid array (FCBGA) packages; one with an exposed molded die and a second with a lid. Eleven different heat sink designs and two different thermal interface materials (TIM) were tested to quantify the thermal interaction between heat sink size, base material and TIM resistance as a function of package style. Package style and TIM material did not appreciably change the total thermal resistance (less than 10%) for small heat sinks 50mm x 50mm smaller. The exposed molded die package thermal resistance was 14% smaller than the lidded package when tested with a heat pipe heat sink. An understanding of the long term performance impact of TIM II degradation was investigated using conduction based models. Lidded style packages may increase safety margin when TIM II materials experience pump-out, dry-out or voiding.

show abstract

Section: Introductionmentioning

confidence: 99%