Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer

Zhang, H. Y.; Zhang, X. W.

doi:10.1007/s11664-015-3715-7

Cited by 7 publications

(3 citation statements)

References 7 publications

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“…First, high- performance chips are laterally placed close to each other while their temperature-sensitivity and mechanical-reliability metrics are different. This is a common scenario in 2.5D package platforms [28,46,79,[82][83][84][85][86][87][88][89][90][91][92][93]. Second, high-performance chips are vertically stacked, while the thermal resistance increases with the number of stacked chips.…”

Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

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Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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“…With the demand for multifunction and miniaturization of microelectronics, various packaging designs have been developed to integrate multiple components. The increasing complexity of microelectronics packaging leads to an increase in die density. − High-power components (logic, GPU) and temperature-sensitive low-power components (memory, sensor) are placed close to one another, and the heat generated by the high-power components can cause an unintended increase in the temperature of a nearby component. This is called thermal crosstalk, which can result in decreased device performance or, in extreme cases, thermal runaway of the entire system.…”

Section: Introductionmentioning

confidence: 99%

Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer

Kim,

Ma,

Tian

2024

ACS Appl. Eng. Mater.

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With the continuous miniaturization of microelectronics, the need to effectively prevent thermal crosstalk between adjacent functional blocks is increasing. This study focuses on mitigating thermal crosstalk between high-and low-power components within the die-embedded glass interposer by incorporating a thermal isolation material�polyimide (PI) aerogels. Polyimide aerogels possess ultralow thermal conductivity of 0.029 W/(m K), low dielectric constant in the range of 1−3, and hightemperature stability up to 400 °C, which makes them an ideal candidate for a thermal isolation material. Given the complexity of the actual configurations, we leverage simulations to evaluate the isolation performance in this initial study. We first conducted infrared (IR) camera measurements on a simplified test setup to validate the thermal model. The results confirm the superior thermal isolation performance of PI aerogels, thereby demonstrating their potential as highly effective thermal isolation materials for microelectronic applications.

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“…This limitation can potentially be overcome by incorporating copper structures and thin heat spreaders for the enhancement of thermal performance. A number of studies have investigated the thermal characteristics of interposers through simulation (Lau and Yue, 2009;Zhang and Zhang, 2015). Also, a few experimental thermal characterizations of interposer structures have been reported, and compared with simulations (Oprins et al, 2011;Zhang et al, 2014).…”

Section: Introductionmentioning

confidence: 99%

Multi-scale thermal modeling of glass interposer for mobile electronics application

Cho

Tummala

Joshi

2016

International Journal of Numerical Methods for Heat &Amp; Fluid Flow

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Purpose -The functionality of personal mobile electronics continues to increase, in turn driving the demand for higher logic-to-memory bandwidth. However, the number of inputs/outputs supported by the current packaging technology is limited by the smallest achievable electrical line spacing, and the associated noise performance. Also, a growing trend in mobile systems is for the memory chips to be stacked to address the growing demand for memory bandwidth, which in turn gives rise to heat removal challenges. The glass interposer substrate is a promising packaging technology to address these emerging demands, because of its many advantages over the traditional organic substrate technology. However, glass has a fundamental limitation, namely low thermal conductivity (~1 W/m K). The purpose of this paper is to quantify the thermal performance of glass interposer-based electronic packages by solving a multi-scale heat transfer problem for an interposer structure. Also, this paper studies the possible improvement in thermal performance by integrating a fluidic heat spreader or vapor chamber within the interposer. Design/methodology/approach -This paper illustrates the multi-scale modeling approach applied for different components of the interposer, including Through Package Vias (TPVs) and copper traces. For geometrically intricate and repeating structures, such as interconnects and TPVs, the unit cell effective thermal conductivity approach was used. For non-repeating patterns, such as copper traces in redistribution layer, CAD drawing-based thermal resistance network analysis was used. At the end, the thermal performance of vapor chamber integrated within a glass interposer was estimated by using an enhanced effective thermal conductivity, calculated from the published thermal resistance data, in conjunction with the analytical expression for thermal resistance for a given geometry of the vapor chamber. Findings -The limitations arising from the low thermal conductivity of glass can be addressed by using copper structures and vapor chamber technology. Originality/value -A few reports can be found on thermal performance of glass interposers. However thermal characteristics of glass interposer with advanced cooling technology have not been reported.

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Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer

Cited by 7 publications

References 7 publications

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer

Multi-scale thermal modeling of glass interposer for mobile electronics application

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