Thermal Isolation Performance of Polyimide Aerogel within a Die-Embedded Glass Interposer

Abstract

With the continuous miniaturization of microelectronics, the need to effectively prevent thermal crosstalk between adjacent functional blocks is increasing. This study focuses on mitigating thermal crosstalk between high-and low-power components within the die-embedded glass interposer by incorporating a thermal isolation material�polyimide (PI) aerogels. Polyimide aerogels possess ultralow thermal conductivity of 0.029 W/(m K), low dielectric constant in the range of 1−3, and hightemperature stability up to 400 °C, which makes them an ideal candidate for a thermal isolation material. Given the complexity of the actual configurations, we leverage simulations to evaluate the isolation performance in this initial study. We first conducted infrared (IR) camera measurements on a simplified test setup to validate the thermal model. The results confirm the superior thermal isolation performance of PI aerogels, thereby demonstrating their potential as highly effective thermal isolation materials for microelectronic applications.

Measurements of Thermal Resistance Across Buried Interfaces with Frequency-Domain Thermoreflectance and Microscale Confinement

“…SiO 2 is fast becoming a prolific material in modern micro- and optoelectronic devices. For example, glass has been proposed as an interposer in modern 2.5D and 3D packaging architectures due to its large electrical resistivity and ease of manufacturing across large surfaces. − Typically, metal thermal vias (e.g., copper traces) are fanned out across the interposer structure, and connected within a dielectric redistribution layer. Because the glass interposer represents a large fraction of the area across which heat can be dissipated from the active components in a chip, and materials are relatively thin, the metal-glass and glass-dielectric interfaces may be thermal bottlenecks for thermal management.…”