1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
DOI: 10.1109/ectc.1998.678711
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Flip chip for AMD K6 microprocessor

R.N. Master
1
,
Mohammad Ayoub Khan2,
M I Guardado3
et al.
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Flip-chip package with a heat spreader for high power dissipation LSI chips

Ando
1
,
Kikuchi
2
,
Satô3
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
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Flip-chip package with a heat spreader for high power dissipation LSI chips

Ando
1
,
Kikuchi
2
,
Satô3
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
5
0
3
0
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Kinetics of C4 bump degradation in overly aggressive HTOL

Master
1
,
Blish2,
Morken3
et al.
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
3
0
1
0
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Numerical analysis of laser thermal compression bonding for flip chip package

Lee
1
,
Park
2
,
Nam
3
et al. 2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
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