Numerical analysis of laser thermal compression bonding for flip chip package

Lee, Won Jae; Park, Jin Yeong; Nam, Hyun Jin; Choa, Sung‐Hoon

doi:10.1109/eptc.2018.8654308

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018

DOI: 10.1109/eptc.2018.8654308

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Numerical analysis of laser thermal compression bonding for flip chip package

Won Jae Lee

Jin Yeong Park

Hyun Jin Nam

et al.

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Numerical analysis of laser thermal compression bonding for flip chip package

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References 7 publications

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