Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force

Clark, W. I.; Shih, Albert J.; Hardin, Craig W.; Lemaster, Richard L.; McSpadden, S.B.

doi:10.1016/s0890-6955(02)00215-8

Cited by 132 publications

(64 citation statements)

References 7 publications

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“…Stress concentration is effective upon contact loading, and the probability of encountering flaws into sectioned specimens increases with increasing dimensions of the contact area. As already demonstrated, contact area of wire saws is about an order of magnitude smaller compared to that of high-end super thin saw blades 12 . It should be pointed out that this enamel friability was exacerbated due to the reduced areas of stick-shaped specimens used in this study.…”

Section: Discussionmentioning

confidence: 67%

“…As a result, high incidences of premature failure and low bond strength values in enamel have frequently being reported 2,4,10,11 . [12][13][14] , demonstrated that sectioning with a diamond wire can be an alternative to minimize the introduction of structural defects into brittle specimens. And, recently, the MicroSpecimen Former (University of Iowa, IA, USA) has been employed to standardize the trimming process and could also be an option to avoid additional stress into microtensile specimens 15 .…”

Section: Introductionmentioning

confidence: 99%

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Influence of specimens' design and manufacturing process on microtensile bond strength to enamel: laboratory and FEA comparison

et al. 2010

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This study evaluated the effect of specimens' design and manufacturing process on microtensile bond strength, internal stress distributions (Finite Element Analysis -FEA) and specimens' integrity by means of Scanning Electron Microscopy (SEM) and Laser Scanning Confocal Microscopy (LCM). Excite was applied to flat enamel surface and a resin composite build-ups were made incrementally with 1-mm increments of Tetric Ceram. Teeth were cut using a diamond disc or a diamond wire, obtaining 0.8 mm 2 stick-shaped specimens, or were shaped with a Micro Specimen Former, obtaining dumbbell-shaped specimens (n = 10). Samples were randomly selected for SEM and LCM analysis. Remaining samples underwent microtensile test, and results were analyzed with ANOVA and Tukey test. FEA dumbbell-shaped model resulted in a more homogeneous stress distribution. Nonetheless, they failed under lower bond strengths (21.83 ± 5.44 MPa) c than stick-shaped specimens (sectioned with wire: 42.93 ± 4.77 MPa a ; sectioned with disc: 36.62 ± 3.63 MPa b ), due to geometric irregularities related to manufacturing process, as noted in microscopic analyzes. It could be concluded that stick-shaped, nontrimmed specimens, sectioned with diamond wire, are preferred for enamel specimens as they can be prepared in a less destructive, easier, and more precise way.

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Section: Discussionmentioning

confidence: 67%

Section: Introductionmentioning

confidence: 99%

Influence of specimens' design and manufacturing process on microtensile bond strength to enamel: laboratory and FEA comparison

et al. 2010

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“…8 Fig . 3 shows the results of force signals during the cutting process with different initial wire deflections.…”

Section: Effect Of Wire Deflection On Cutting Abilitymentioning

confidence: 99%

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Kim

Lee

et al. 2015

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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Sapphire wafers are widely used as substrates for fabricating gallium nitride light-emitting diodes. The quality of light-emitting diodes depends on the total thickness variation and BOW of the wafers. The multi-wire saw process is critical in determining post-processing times for steps such as diamond mechanical polishing and chemical mechanical polishing. In particular, thickness variation is affected by wear of diamond wires, which in turn is controlled by cutting conditions including wire speed, feed rate, initial contact condition between ingot and wire, and new wire consumption. Thickness variation shows a marked change from the initial to final feeding location during the multi-wire sawing process. A wire is not worn when it is initially contacted by an ingot. Hence, the initial kerf loss is greater than the kerf loss at the final feeding location. This study focused on minimizing the thickness variation between the initial and final contact points of the wafer. Experiments were conducted with different initial wire deflection conditions. The experimental results showed that increasing the wire deflection increased the cutting load, which in turn caused severe wear of the wire. Consequently, the thickness variation of the wafer in the multi-wire sawing process was controlled by adjusting the wire deflection.

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“…Taip pat buvo pasirinktas pastovus svyravimo judesių intervalas vielai pjaunant nuo nulio iki dviejų laipsnių ir pastovus jo keitimosi greitis (5 pav.) (Clark et al 2003a(Clark et al , 2003b. Keičiama buvo tik vertikalaus rėmo pastūma F (6 pav.).…”

Section: Tyrimų Stendas Medžiagos Ir Metodikaunclassified

Research on Cutting Crystals Soluble in Water / Vandenyje Tirpių Kristalų Pjaustymo Tyrimai

Vilkelis

Jurevičius

2015

Mokslas – Lietuvos Ateitis

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Vaizdų technologijos T 111 Image Technologies T 1112014 © Straipsnio autoriai. Leidėjas VGTU leidykla "Technika". Šis straipsnis yra atvirosios prieigos straipsnis, turintis Kūrybinių bendrijų (Creative Commons) licenciją (CC BY-NC 4.0), kuri leidžia neribotą straipsnio ar jo dalių panaudą su privaloma sąlyga nurodyti autorių ir pirminį šaltinį. Straipsnis ar jo dalys negali būti naudojami komerciniams tikslams. MOKSLAS -LIETUVOS ATEITIS SCIENCE -FUTURE OF LITHUANIA ĮvadasTobulėjant kietųjų medžiagų apdirbimo technologiniams procesams, atsiranda vis daugiau galimybių atlikti tam tikrus pjovimo procesus (nuo atpjovimo iki baigiamojo apdirbimo), kurių anksčiau atlikti nebuvo galimybių. Ankstesniame tyrime, naudojant modernias deimantinės vielos pjaustymo stakles "RTS 440", buvo bandoma atpjauti ypač kietas medžiagas (kristalus), tokias kaip safyras, kvarcas, granatas, kurias atpjauti yra labai sunku, o kai kuriais atvejais visai neįmanoma. Tačiau apdirbant lazerinėje technikoje naudojamus kristalus taip pat susiduriama su kita problema -nemaža dalis lazerinėje technikoje naudojamų kristalų yra tirpūs vandenyje.Daugeliu atvejų, pjaunant kristalus, aušinti naudojamas skystis yra sudarytas iš įvairių emulsiklių ar lubrikantų, kurių pagrindą sudaro vanduo. Todėl pjaunant vandenyje tirpius kristalus ir aušinti naudojant skystį, kurio pagrindas yra vanduo, kristalai paprasčiausiai pradėtų tirpti, todėl, pjaunant tokius kristalus, reikalingos specifinės aušinimo priemonės arba atpjovimo būdai (Semibratov et al. 1978).Pjaunant deimantine viela vandenyje tirpius kristalus, aušinti galima naudoti ne vandens pagrindu sudarytus skysčius, todėl pjovimo technologija nesikeičia nepriklausomai nuo to, kokios prigimties (ar ypač kietas, ar tirpus vandenyje) kristalas yra pjaunamas, deimantinės vielos pjovimo privalumai išlieka tokie patys. Todėl tai nedaro įtakos pjaunamo kristalo atpjovimo konstrukcijai, tai yra deimantine viela be didesnių problemų galima atpjauti sudėtingos geometrinės formos detales (Hardin 2003).Todėl šiame darbe buvo atliekamas tyrimas, kurio metu deimantinės vielos pjaustymo staklėmis buvo pjaustomas vandenyje tirpus kristalas KDP, siekiant nustatyti KDP paviršiaus vidutinio aritmetinio profilio nuokrypio Ra pastūmos priklausomybę. Tyrimų stendas, medžiagos ir metodikaKDP kristalas buvo pjaustomas stendu, kurio pagrindas yra deimantinės vielos pjaustymo staklės "RTS 440" (1 pav.) su papildoma aušinimo sistema.

show abstract

Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force

Cited by 132 publications

References 7 publications

Influence of specimens' design and manufacturing process on microtensile bond strength to enamel: laboratory and FEA comparison

Influence of specimens' design and manufacturing process on microtensile bond strength to enamel: laboratory and FEA comparison

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Research on Cutting Crystals Soluble in Water / Vandenyje Tirpių Kristalų Pjaustymo Tyrimai

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