“…[1][2][3] Apart from the function of mounting die, the polymer layer also provides the capability of isolating the die from thermal stress induced by temperature change. [4] Therefore, the packaging quality heavily depends on the polymer property, such as Glass transition temperature (T g ), Young's modulus and shear modulus, because these parameters have a great influence on the residual stress level and long-term stability of packaged devices. [5][6] However, the polymer property is critically related to the parameters of curing process during which the polymer transforms into solid state from liquid state, therefore, to obtain the property experimentally is very complicated and expensive.…”