Fabrication of multi-tiered structures on step and flash imprint lithography templates

Johnson, Stephen C.; Resnick, Douglas J.; Mancini, David P.; Nordquist, Kevin J.; Dauksher, William J.; Gehoski, Kathleen A.; Baker, J.; Dues, L.; Hooper, Andy; Bailey, Todd; Sreenivasan, S. V.; Ekerdt, John G.; Willson, C. Grant

doi:10.1016/s0167-9317(03)00075-3

Cited by 24 publications

(12 citation statements)

References 9 publications

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“…14 It is interesting to note that the methods described in this section can also be used sequentially to form multilayer structures that can be used to fabricate devices such as T-gates or optical grating couplers. 15 SEM pictures depicting two-tiered and three-tiered structures are shown in Fig. 6.…”

Section: Step and Flash Imprint Lithography S-fil Templatementioning

confidence: 99%

Imprint lithography for integrated circuit fabrication

Resnick

Dauksher

Mancini

et al. 2003

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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119

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The escalating cost for next generation lithography (NGL) tools is driven in part by the need for complex sources and optics. The cost for a single NGL tool could exceed $50M in the next few years, a prohibitive number for many companies. As a result, several researchers are looking at low cost alternative methods for printing sub-100 nm features. In the mid-1990’s, several research groups started investigating different methods for imprinting small features. Many of these methods, although very effective at printing small features across an entire wafer, are limited in their ability to do precise overlay. In 1999, Colburn et al. [Proc. SPIE 379 (1999)] discovered that imprinting could be done at low pressures and at room temperatures by using low viscosity UV curable monomers. The technology is typically referred to as step and flash imprint lithography. The use of a quartz template enabled the photocuring process to occur and also opened up the potential for optical alignment of the wafer and template. This article traces the development of nanoimprint lithography and addresses the issues that must be solved if this type of technology is to be applied to high-density silicon integrated circuitry.

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Section: Step and Flash Imprint Lithography S-fil Templatementioning

confidence: 99%

Imprint lithography for integrated circuit fabrication

Resnick

Dauksher

Mancini

et al. 2003

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

Self Cite

119

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“…This problem has been addressed by using multilayer techniques involving etch barriers and transfer layers in combination with RIE to indirectly produce high aspect ratio structures. Higher order 3D patterns can also be fabricated using multilayer moulds [283,284]. Polymers molded by NIL can also act as functional components of devices, not just as replacements for photoresists [269,285].…”

Section: Nanoimprint Lithographymentioning

confidence: 99%

Unconventional methods for forming nanopatterns

Stewart

Motala

Yao

et al. 2006

Proceedings of the Institution of Mechanical Engineers, Part N:

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Nanostructured materials have become an increasingly important theme in research, in no small part due to the potential impacts this science holds for applications in technology, including such notable areas as sensors, medicine, and high-performance integrated circuits. Conventional methods, such as the top-down approaches of projection lithography and scanning beam lithography, have been the primary means for patterning materials at the nanoscale. This article provides an overview of unconventional methods -both top-down and bottom-up approaches -for generating nanoscale patterns in a variety of materials, including methods that can be applied to fragile molecular systems that are difficult to pattern using conventional lithographic techniques. The promise, recent progress, advantages, limitations, and challenges to future development associated with each of these unconventional lithographic techniques will be discussed with consideration given to their potential for use in large-scale manufacturing.

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“…6,14,15) [1][2][3]6) and low-temperature ultraviolet (UV) curing (or step-and-flash lithography). 7,8) However, there are still many challenges in transferring patterns to a flexible plastic substrate by imprint lithography. [16][17][18][19] Imprint lithography on flexible substrates is more difficult than on silicon or glass substrates because of the low glass transition temperatures (T g ) of plastic substrates, usually around 150 C. This results in a severe limitation on the imprinting temperature, in order to avoid the deformation of plastic substrate.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Organic Light-Emitting Diode Arrays on Flexible Plastic Substrates by Imprint Lithography

Cheng¹,

Hong²

2006

Jpn. J. Appl. Phys.

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Imprint lithography has been employed as a patterning technology for the fabrication of organic light-emitting diode (OLED) device arrays on flexible poly(ethylene terephthalate) (PET) substrates. Poly(methyl methacrylate) (PMMA) was used as the etching barrier coated on an indium tin oxide (ITO)/PET substrate. A silicon mold fabricated by photolithography was coated with a fluorinated diamond-like carbon film for easy mold-releasing. By hot pressing the silicon mold on the PMMA-coated ITO/PET substrate and etching in oxalic acid solution, patterned ITO strips were obtained. Imprint lithography was repeated to fabricate PMMA ribs vertical to the ITO strips. Finally, a matrix of 40 Â 40 OLED devices (300 Â 300 mm 2 ) was fabricated with an area of 25 Â 25 mm 2 after depositing the organic and cathode layers consisting of TPD/Alq 3 /Bphen/LiF/Al. High quality OLED arrays on flexible PET substrate were obtained with a turn-on voltage of around 5 V, a luminous efficiency of 3 cd/A, a power efficiency of 1.2 lm/W, and a luminance of 800 cd/m 2 operated at 7 V on the basis of the actual light emitting area.

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Fabrication of multi-tiered structures on step and flash imprint lithography templates

Cited by 24 publications

References 9 publications

Imprint lithography for integrated circuit fabrication

Imprint lithography for integrated circuit fabrication

Unconventional methods for forming nanopatterns

Fabrication of Organic Light-Emitting Diode Arrays on Flexible Plastic Substrates by Imprint Lithography

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