2008
DOI: 10.1088/1464-4258/10/4/044001
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Fabrication of a multi-level lens using independent-exposure lithography and FAB plasma etching

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Cited by 12 publications
(7 citation statements)
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“…Next, E-beam exposed silicon substrate was developed in ZEP 520 developer for 5 min and washed in the rinse-filled beaker (methyl isobutyl ketone) for 30 sec in the water pool at a temperature of 23 ∘ C and then postbaked for 3 min at 110 ∘ C. As seen in Figure 5(d), the PR patterned 1D and 2D DOEs (300 m by 300 m) on the silicon substrate were fabricated. FAB etching has a good directionality and a constant etching ratio (1 : 1) between the silicon and PR [10,13,18,19]. The FAB etching ratio, 21.0 nm/min, was calibrated under an etching condition as shown in Figure 6.…”
Section: Fabricationmentioning
confidence: 99%
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“…Next, E-beam exposed silicon substrate was developed in ZEP 520 developer for 5 min and washed in the rinse-filled beaker (methyl isobutyl ketone) for 30 sec in the water pool at a temperature of 23 ∘ C and then postbaked for 3 min at 110 ∘ C. As seen in Figure 5(d), the PR patterned 1D and 2D DOEs (300 m by 300 m) on the silicon substrate were fabricated. FAB etching has a good directionality and a constant etching ratio (1 : 1) between the silicon and PR [10,13,18,19]. The FAB etching ratio, 21.0 nm/min, was calibrated under an etching condition as shown in Figure 6.…”
Section: Fabricationmentioning
confidence: 99%
“…The diffractive optical elements (DOEs) can overcome such problems. Recently, a great deal of research in DOEs has been performed [6][7][8][9][10][11][12][13]. The DOEs play an important role in many optical applications, including optical telecommunications components, multiple imaging, light-collecting, and spectroscopy applications, because of their high uniformity, light weight, and miniaturization in size [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%
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