1999
DOI: 10.1088/0960-1317/9/2/005
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Fabrication and characterization of a piezoelectric accelerometer

Abstract: Zinc oxide based piezoelectric accelerometers were fabricated by bulk micromachining. A high yield was obtained in a relatively simple process sequence. For two electrode configurations a direction selectivity better than 100 was obtained for acceleration in the vertical direction and a selectivity of 3 for acceleration in the horizontal direction, respectively. The charge sensitivity in the vertical direction is better than 0.1 pC g −1 and a noise level of 1 × 10 −4 g Hz −1/2 was estimated.

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Cited by 48 publications
(27 citation statements)
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“…The sensitivity of the device was found to be 16 pC/m/s 2 in the z-direction which is excellent especially when compared to other micromachined silicon accelerometers using thin-®lm piezoelectric sensing materials. For example, the device presented in [10] which consists of a sputtered zinc oxide (ZnO) piezoelectric ®lm has a sensitivity of 0.15 pC/m/s 2 . In this instance, the advantage of the thick-®lm piezoelectric layer is clear.…”
Section: Accelerometer Resultsmentioning
confidence: 99%
“…The sensitivity of the device was found to be 16 pC/m/s 2 in the z-direction which is excellent especially when compared to other micromachined silicon accelerometers using thin-®lm piezoelectric sensing materials. For example, the device presented in [10] which consists of a sputtered zinc oxide (ZnO) piezoelectric ®lm has a sensitivity of 0.15 pC/m/s 2 . In this instance, the advantage of the thick-®lm piezoelectric layer is clear.…”
Section: Accelerometer Resultsmentioning
confidence: 99%
“…Considering a distributed force, F, acting perpendicularly to the cantilever surface as shown in Fig. 1(a), the inverse of the radius of curvature (r) can be expressed as, process sequence suitable for batch fabrication of both accelerometers and encapsulation [7]. The single-chip accelerometer can be fitted into a flat package which is advantageous for SHM applications [7].…”
Section: Displacement Modellingmentioning
confidence: 99%
“…encapsulation [7]. The single-chip accelerometer can be fitted into a flat package which is advantageous for SHM applications [7].…”
mentioning
confidence: 99%
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