Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (&lt;6 µm) and Reliable Flexible Cu-Based Interconnects

Hanna, Amir; Alam, A. H. M. Zahirul; Fukushima, T.; Moran, Steven L.; Whitehead, W.S.; Jangam, Siva Chandra; Pal, Saptadeep; Ezhilarasu, Goutham; Irwin, R. John; Bajwa, Adeel; Iyer, Subramanian S.

doi:10.1109/ectc.2018.00229

Cited by 21 publications

(4 citation statements)

References 21 publications

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“…Fukushima et al, have introduced special stress buffer layers to minimize stresses in metal structures [7]. Corrugated structures for Cu wires have been introduced by Hanna et al to improve the reliability of metal wires during bending [8].…”

Section: Bendability In Flexible Fan-out Processmentioning

confidence: 99%

Reliability challenges in advance packaging

Iyer

Bajwa

2018

2018 IEEE International Reliability Physics Symposium (IRPS)

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This paper highlights the packaging related reliability issues in various advanced packaging schemes such as 3-D stacking, interposers, fan-out packaging, and the more recently developed silicon interconnect fabric integration. The need for heterogeneous integration, superior electrical and thermal performance, reduction of form factor and overall systemfootprint, and integration of high-density interconnects are the main driving forces behind the development of these advanced packaging techniques. As the packaging and system integration is becoming more complex, the emphasis is mainly on improving the reliability of system-level packaging rather than the individually packaged devices.

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Section: Bendability In Flexible Fan-out Processmentioning

confidence: 99%

Reliability challenges in advance packaging

Iyer

Bajwa

2018

2018 IEEE International Reliability Physics Symposium (IRPS)

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“…We propose a structurally new FHE to address the abovementioned wire density, functional degradation, and fabrication issues. [23][24][25] The device uses inorganic single-crystal semiconductors, especially Si, and does not use organic, amorphous, or polycrystalline semiconductors. This concept is influenced by conventional 2D serpentine wire designs 26) and leverages a previously proposed 3D interconnect technology.…”

Section: Introductionmentioning

confidence: 99%

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Liu,

Hoshi,

Shen

et al. 2024

Jpn. J. Appl. Phys.

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This study focuses on enhancing the bendability of flexible interconnections with out-of-plane corrugation for flexible hybrid electronics (FHE). We propose two typical configurations of the 3D corrugated interconnections: serpentine and trapezoidal configuration. Three optional methods are introduced to fabricate the 3D corrugated interconnections. The advantages and drawbacks of the fabrication strategies are discussed, and the impact of the geometry and material of the 3D corrugation on bendability is argued. The result shows that the resistance increase of the 3D corrugated interconnections after the 5-mm-radius-bending test is drastically lowered by ~2,000% compared to conventional 2D planar interconnections.

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“…A structurally new FHE has been developed based on die-first/face-down FOWLP technology [16] with dielets using PDMS that has a low Young's modulus like a rubber and is curable at low temperature even at room temperature. The die-shift assessment has been given by UCLA [17] where the die shift is estimated to be < 6 μm. We believe that the curing shrinkage of mold compounds is independent on the die shift when molding with PDMS through additive polymerization because the curing shrinkage of the PDMS is approximately 1% or less.…”

Section: Introductionmentioning

confidence: 99%

Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

Fukushima

Susumago

Zhou

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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Typical die shift is beyond several tens micrometers or more, which is a serious problem on advanced fan-out wafer-level packaging (FOWLP), to give inevitable misalignment errors in the subsequent photolithography processes for fine-pitch redistributed wiring layer (RDL) formation. In particular, this problem is expected to grow all the more serious in chiplets and tiny dies less than 1 mm in a side. In this work, the use of an anchoring layer is proposed to fix these dies/chiplets on a double-side laminate thermo release tape and drastically reduce the die shift. In addition, an on-nail photoplethysmogram (PPG) sensor system as a flexible hybrid electronics (FHE) is integrated with μLED (270 μm by 270 μm) based on a die-first FOWLP methodology using a biocompatible polydimethylsiloxane (PDMS) mold resin for real-time monitoring pulse wave and percutaneous oxygen saturation (SpO2). The repeated bendability of fan-out Au wirings formed on the PDMS and the current-voltage (I-V) behavior of the μLED before and after die embedment in the PDMS is characterized.

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Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects

Cited by 21 publications

References 21 publications

Reliability challenges in advance packaging

Reliability challenges in advance packaging

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

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