Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Abstract

This study focuses on enhancing the bendability of flexible interconnections with out-of-plane corrugation for flexible hybrid electronics (FHE). We propose two typical configurations of the 3D corrugated interconnections: serpentine and trapezoidal configuration. Three optional methods are introduced to fabricate the 3D corrugated interconnections. The advantages and drawbacks of the fabrication strategies are discussed, and the impact of the geometry and material of the 3D corrugation on bendability is argued. The result shows that the resistance increase of the 3D corrugated interconnections after the 5-mm-radius-bending test is drastically lowered by ~2,000% compared to conventional 2D planar interconnections.