Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation

Urbanski, K.; Fałat, Tomasz; Felba, Jan; Mościcki, Andrzej; Smolarek, Anita; Bonfert, Detlef; Bock, Karlheinz

doi:10.1109/nano.2012.6322120

Cited by 4 publications

(3 citation statements)

References 5 publications

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“…Urbański et al [ 164 ] also employed high frequency and high voltage (HFHV) electric energy to sinter nanoparticles, and applied the process to print a conductive pathway with nanosilver ink.…”

Section: Rapid Sintering Processes Of Nanoparticlesmentioning

confidence: 99%

Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Liu

Wang

et al. 2018

Micromachines

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Recently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be sintered at lower temperature compared to bulk silver, applications of nanosilver pastes are limited by long-term sintering time (20–30 min), relative high sintering temperature (>250 °C), and applied external pressure, which may damage chips and electronic components. Therefore, low temperature rapid sintering processes that can obtain excellent nanosilver joints are anticipated. In this regard, we present a review of recent progress in the rapid sintering of nanosilver pastes. Preparation of nanosilver particles and pastes, mechanisms of nanopastes sintering, and different rapid sintering processes are discussed. Emphasis is placed on the properties of sintered joints obtained by different sintering processes such as electric current assisted sintering, spark plasma sintering, and laser sintering, etc. Although the research on rapid sintering processes for nanosilver pastes has made a great breakthrough over the past few decades, investigations on mechanisms of rapid sintering, and the performance of joints fabricated by pastes with different compositions and morphologies are still far from enough.

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Section: Rapid Sintering Processes Of Nanoparticlesmentioning

confidence: 99%

Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Liu

Wang

et al. 2018

Micromachines

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show abstract

“…The current assisted sintering process could be divided into three stages: rearrangement of adjacent nanosilver particles, liquid phase assisted densification, and densification by plastic deformation and elimination of crystal defects. Urbański et al [164] also employed high frequency and high voltage (HFHV) electric energy to sinter nanoparticles, and applied the process to print a conductive pathway with nanosilver ink.…”

Section: Current Assisted Sinteringmentioning

confidence: 99%

Interface Circuits for Microsensor Integrated Systems

2018

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Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures are a focus of growing interest, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a strong interest in interface design; particularly, analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems is more difficult to meet in the interface design due to the need for energy-aware cost-effective circuit interfaces integration and, where possible, energy harvesting solutions. The objective of this Special Issue has been to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue presents and highlights the advances and the latest novel and emergent results on this topic, showing best practices, implementations, and applications. There are 10 papers published in this Special Issue, covering micromachined sensors interfacing circuits [1-4], techniques for sensor interrogation and conditioning circuits [5-7], and sensors and systems design [8-10]. In particular, Malcovati et al. presented an overview of MEMS microphones evolution interfacing based on actual design examples, focusing on the latest cutting-edge solutions [1]. Kim et al. proposed a reconfigurable sensor analog front-end using low-noise chopper-stabilized delta-sigma capacitance-to-digital converter (CDC) for capacitive microsensors [2]. Qiao et al. addressed an alternative to capacitive MEMS accelerometers interface circuits, conventionally based on charge-based approaches, based on frequency-based readout techniques that have demonstrated they have some unique advantages [3]. Pantoli et al. proposed a novel interface circuits for micromachined silicon photomultipliers based on a second-generation voltage conveyor as an active element, performing as a transimpedance amplifier [4]. On the interrogation and conditioning circuits side, Hu et al., in order to match the high output impedance of Tribo-electric-Nano-generator (TENG) and increase the output power, presented an adaptable interface conditioning circuit, which is composed of an impedance matching circuit, a synchronous rectifier bridge, a control circuit, and an energy storage device [5]. D'Amico et al. presented the study of useful electrical properties of directly coupled L-C cells forming a discrete ladder network (L-C L.N.) to be applied to the sensor field up to be applied on a large scale down to micrometric dimensions in agreement ...

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“…-local heating; energy is absorbed only by printed structure when it is heated by laser beam [10,11], by pulsed light [12], or by UV light [13], -delivering microwave energy [14], -electrical excitation [15], -chemical reaction in low temperature [16].…”

Section: J Felba T Fałat and A Mościckimentioning

confidence: 99%

Nano sized silver for electronic packaging

Felba

Fałat

Mościcki³

2013

2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013)

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Production of modern microelectronic devices needs advanced materials and packaging technologies oriented towards the miniaturization and high reliability of the systems. Nano sized silver can be treated as such advanced material and it is used in modern packaging technologies, especially for flexible electronics. The paper presents information about the practical use of silver particles with the size from 4 nanometers in materials for electronic packaging technologies.The special ink containing nanosilver is use for ink-jet printing electrically conductive structures. Such process can be applied for flexible electronics even when structures are printed on temperature sensitive materials. Ink-jet printing may be used for creating the conductive layers of microvias joining both sides of flexible substrates with acceptable level of resistance. Nano sized silver is also used as a component of hybrid filler for electrically and thermally conductive polymer based composites, although the role of nanosilver particles in transport of current or heat in such materials is limited. Nanosilver plays an increasingly important role in joints elements working at high temperatures. The sintering process is done at temperatures significantly below 300 °C and the highest shear strength of joined elements reached several dozens of MPa.J. Felba is with the Faculty

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Experimental method for low-temperature sintering of nano-Ag inks using electrical excitation

Cited by 4 publications

References 5 publications

Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Interface Circuits for Microsensor Integrated Systems

Nano sized silver for electronic packaging

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