Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Liu, Wei; An, Rong; Wang, Chunqing; Zheng, Zhen; Tian, Yanhong; Xu, Ronglin; Wang, Zhongtao

doi:10.3390/mi9070346

Cited by 37 publications

(14 citation statements)

References 153 publications

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“…An obvious fracture is found at the interparticle bonds. The joint strength of Ag NP paste is mainly determined by the sintered bond between contacting Ag NPs [ 79 ]. The sphere-sphere model of particle sintering has been used to analyze the sintering mechanism of NPs as well as the relationship between the strength and microstructure.…”

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

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Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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“…Tab. 2 lists the recommended pressure and cost estimation for the silver-sintering materials with scales of different particles [18,[32][33][37][38][39][40][41][42][43][44][45][46][47][48][49][50] .…”

Section: Pressure-assisted Sinteringmentioning

confidence: 99%

Brief review of silver sinter-bonding processing for packaging high-temperature power devices

Yan

Liang

Mei

et al. 2020

Chin. J. Electr. Eng.

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Silver sintering is receiving increasing attention due to its novel die-attach technique for high-temperature power electronics. Excellent thermal conductivity, high melting point/remelting temperature and low-temperature sintering behaviors of the silver sintered attachment meet the requirements of high-temperature applications for power devices, specifically SiC devices. The merits and demerits of the existing pressure-assisted sintering and pressure-less sintering techniques using nano-scale, micro-scale and micro-nano-scale hybrid silver sintered materials are separately presented. The emerging rapid sintering approaches, such as the electric-assisted approach, are briefly introduced and the technical outlook is provided. In addition, the study highlights the importance of creating a brief resource guide on using the correct sintering methods.

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“…Spark plasma sintering (SPS) is a sintering process that integrates plasma activation, resistance heating and hot pressing; it is consistent with the traditional powder metallurgy process [9][10][11][12]. The sintering process is also divided into the initial stage of sintering, the middle stage and the final stage.…”

Section: Introductionmentioning

confidence: 97%

Microstructure and Properties of Porous Titanium Prepared by Spark Plasma Sintering

Liu

Zhang

Shi

et al. 2019

Metals

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Porous titanium samples with a porosity of 1.34~15.54% were prepared by a spark plasma sintering (SPS) process at sintering temperatures of 800 °C, 850 °C and 900 °C, and a sintering pressure of 10 MPa. The microstructures and fracture morphology of the samples were investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD) analyses. The compressive strength and elastic modulus were likewise measured. The results showed that no new phase occurred after the samples were sintered, and the main phases were α phase of hcp structure. The porosity of the samples decreased significantly with the increase of sintering temperature. At 800 °C, the sample phase was dominated by equiaxed α. There were more irregular coarse pores in the samples. At 850 °C, the microstructure was mainly zigzag α, and the pores were finely and relatively uniform in distribution. At 900 °C, the sample’s structure transformed into a dense sheet-like α. The sample’s densities increased and the pores disappeared. The room temperature compression test showed that the porous titanium sintered by SPS had excellent compressive strength. The yield strength, compressive strength, compressive strain and elastic modulus were 81.85~122.36 MPa, 161.65~498.86 MPa, 36.75~59.97% and 2.79~4.22 GPa, respectively.

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Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Cited by 37 publications

References 153 publications

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Brief review of silver sinter-bonding processing for packaging high-temperature power devices

Microstructure and Properties of Porous Titanium Prepared by Spark Plasma Sintering

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