Conductive inks market for printable electronic grows rapidly last years. The main disadvantage of using inks filled with nano-Ag particles is sintering process, which often requires relatively high temperatures (over 180°C). This forces the use of expensive, high temperature substrates, for example polyimide foils. In some applications it is unacceptable to subject substrate to high temperature, which prevents or hinders the use of common silver inks. An experimental method for low-temperature sintering was investigated and presented in this paper. Electric field was applied to the sample and current flow induced to initiate the sintering process instead of commonly used high-temperature heating or light pulses
Last decades in reliability prototyping of microelectronic devices show that from a long time there is no good solution to examine it in relatively short time and small expenditure of costs. Currently all thermo-mechanical reliability processes are long-lasting and costly. With using only the most dominating failure mode and cyclic loadings tests can last for a number of months. Companies, which produce their products very fast can't allow on such inconvenience, because this would lead to bankruptcy. To solve that kind of problem in this paper will be proposed new method of reliability investigating. Most of existing methods are concerned on only one failure mode which is dominating under selected loading conditions. Moreover all failure analysis are done under the simplified conditions what means that obtained results are not properly reliable. New presented method aim at using typical failure modes creep and fatigue at the same time while testing. That solution can have an important meaning in the standard Accelerated Thermal Cyclic test, which are based partly on experiment measurements and numerical analysis. Therefore appropriate understanding and development of analytical methods and experimental tools for multifailure criteria analysis could be very helpful. This work presents a methodology based on the use of well known indentation technique and second, innovative method with using new instrument called Failure And Reliability Investigation System created to study creep and fatigue phenomenon carried out on two lead-free alloys: SAC 405(S-SnAg4Cu0.5) and SAC 307(S-SnAg3Cu0.7)
In this paper authors present an improved design methodology consisting of methods and tools that are used to partially automate a task of smart sensor system design. By selecting a number of constraints and parameters of the whole sensor system (not only parameters of selected components), the application is able to generate set of results (each result is a set of components), which meet the pre-defined criteria. For example a designer selects only a range of pressure values that will be measured and an upper limit for current consumption of the whole system. The algorithm can choose combination(s) of integrated circuits according to the user defined requirements. Additionally application is able to evaluate the system performance, cost and assess element values for analog front-end circuit from pre-defined templates and provide SPICE netlist for further electric and / or thermal simulation.
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