2006
DOI: 10.1049/el:20061150
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Enhancement-mode quaternary AlInGaN/GaN HEMT with non-recessed-gate on sapphire substrate

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Cited by 25 publications
(19 citation statements)
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“…Despite the implementation of an ultrathin AlN spacer to reduce the alloy scattering and enhance the 2DEG confinement [3], the growth of the ternary alloy remains challenging. On the other hand, a quaternary InAlGaN compound is attractive as a barrier layer since it allows easier adjustment of the band gap and strain state with suitable Al/In ratios [4][5][6][7][8][9][10]. Recently, we have reported InAlGaN/AlN/GaN heterostructure HEMTs with a sub-10-nm ultrathin quaternary barrier with a state-of-the-art electron mobility of 1800 cm 2¨V´1¨s´1 and a sheet carrier density of 1.9ˆ10 13 cm´2 at room temperature [11].…”
Section: Introductionmentioning
confidence: 99%
“…Despite the implementation of an ultrathin AlN spacer to reduce the alloy scattering and enhance the 2DEG confinement [3], the growth of the ternary alloy remains challenging. On the other hand, a quaternary InAlGaN compound is attractive as a barrier layer since it allows easier adjustment of the band gap and strain state with suitable Al/In ratios [4][5][6][7][8][9][10]. Recently, we have reported InAlGaN/AlN/GaN heterostructure HEMTs with a sub-10-nm ultrathin quaternary barrier with a state-of-the-art electron mobility of 1800 cm 2¨V´1¨s´1 and a sheet carrier density of 1.9ˆ10 13 cm´2 at room temperature [11].…”
Section: Introductionmentioning
confidence: 99%
“…Lanford et al [3] developed the E-mode HEMT with the recessed-gate structure by etching a part of AlGaN layer of the AlGaN/GaN heterostructure, which realized E-mode HEMT by using the depletion effect of Schottky junction on 2DEG. Wang et al [4] reported an E-mode HEMT realized by F ion implant doping and Liu et al [5] demonstrated a non-recessed E-mode device on AlInGaN/GaN. We report a recessed-gate E-mode AlGaN/GaN HEMT, and analyze the influence of recessed-gate depth and annealing temperature on device characteristics.…”
Section: Introductionmentioning
confidence: 92%
“…1 Moreover, Al x In y Ga 1-x-y N material is very promising in the high-frequency, large-power devices application. There are two advantages in Al x In y Ga 1-x-y N material.…”
Section: Introductionmentioning
confidence: 99%
“…It can be concluded from the room temperature Hall mobility data of 2200 cm 2 /(Vs) (Al 0.72 In 0.11 Ga 0.17 N), 4 and 1770 cm 2 /(Vs) (Al 0.83 In 0.13 Ga 0.04 N), 5 and 1318 cm 2 /(Vs) (Al 0. 12 In 0.006 Ga 0.874 N), 6 8 that increasing the composition dependent electron mobility assists to enhance the performance of the In x Al y Ga 1-x-y N heterojunction field effect transistors (HFETs). In our previous work, 9 we established the model of the alloy disorder scattering limited mobility in AlInGaN/GaN heterojunctions using virtual crystal approximation, and put forward some guidance to estimate the direction of the mobility change with the Al(In,Ga)N composition.…”
Section: Introductionmentioning
confidence: 99%