Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect

Mahajan, Ravi; Qian, Zhiguo; Viswanath, R.; Srinivasan, Sriram; Aygün, Kemal; Jen, Wei-Lun; Sharan, S.; Dhall, Ashish

doi:10.1109/tcpmt.2019.2942708

Cited by 65 publications

(20 citation statements)

References 17 publications

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“…The effectiveness of the proposed AWR method is explored for an inter-chip link for 2.5-D integration as interposers support a high wire density. However, note that the method is equally applicable to other state-of-the-art or emerging packaging approaches, such as Embedded Multidie Interconnect Bridge (EMIB) [46] and more broadly to applications that require wide and slow links. The link is assumed to connect two dies that are bump bonded on top of a silicon-based interposer.…”

Section: A Experimental Setupmentioning

confidence: 99%

Energy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication

Maragkoudaki

Pavlidis

2020

IEEE Trans. VLSI Syst.

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The energy for data transfer has an increasing effect on the total system energy as technology scales, often overtaking computation energy. To reduce the power of interchip interconnects, an adaptive encoding scheme called Adaptive Word Reordering (AWR) is proposed that effectively decreases the number of signal transitions, leading to a significant power reduction. A novel circuit is implemented which exploits the time domain to represent complex bit transition computations as delays and, thus, limits the power overhead due to encoding. The effectiveness of AWR is validated in terms of decrease in both bit transitions and power consumption. AWR is shown to yield higher power savings compared to three state-of-theart techniques reaching 23% and 61% during the transfer of multiplexed address-data and image files, respectively, at just 1 mm wire length.

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Section: A Experimental Setupmentioning

confidence: 99%

Energy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication

Maragkoudaki

Pavlidis

2020

IEEE Trans. VLSI Syst.

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“…In addition, it is known that feedthrough noises and losses play a significant role in the electrical actuation and measurements of MEMS and NEMS [ 9 , 10 , 11 , 12 ]. In addition modeling of the parasitic effects of these noise sources was attempted, to minimize the damage [ 13 ].…”

Section: Introductionmentioning

confidence: 99%

“…Sensors 2022, 22, x FOR PEER REVIEW 2 of 16 in the electrical actuation and measurements of MEMS and NEMS [9][10][11][12]. In addition modeling of the parasitic effects of these noise sources was attempted, to minimize the damage [13]. Instead of putting up with these problems, it is aimed to eliminate the source directly by proposing a new concept called built-in packaging.…”

Section: Introductionmentioning

confidence: 99%

Built-In Packaging for Single Terminal Devices

Gulsaran

Azer

Kocer

et al. 2022

Sensors

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An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.

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“…The first trend is an ever‐increasing miniaturization of the electronic elements of the sensor; both for microprocessors [ 7 ] and for electronic packaging. [ 8 ] This trend, primarily due to manufacturing advances, has led to smaller devices with improved functionality, [ 9 ] multiplexing, [ 10 ] improved implantability in biological tissue, [ 11 ] and lower power requirements. The second trend has been the fabrication of soft electronic devices that have an elastic modulus close to that of the tissue in the human body.…”

Section: Introductionmentioning

confidence: 99%

Recent Advances in 3D Printing of Biomedical Sensing Devices

Ali

Yttri

et al. 2021

Adv Funct Materials

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Additive manufacturing, also called 3D printing, is a rapidly evolving technique that allows for the fabrication of functional materials with complex architectures, controlled microstructures, and material combinations. This capability has influenced the field of biomedical sensing devices by enabling the trends of device miniaturization, customization, and elasticity (i.e., having mechanical properties that match with the biological tissue). In this paper, the current state‐of‐the‐art knowledge of biomedical sensors with the unique and unusual properties enabled by 3D printing is reviewed. The review encompasses clinically important areas involving the quantification of biomarkers (neurotransmitters, metabolites, and proteins), soft and implantable sensors, microfluidic biosensors, and wearable haptic sensors. In addition, the rapid sensing of pathogens and pathogen biomarkers enabled by 3D printing, an area of significant interest considering the recent worldwide pandemic caused by the novel coronavirus, is also discussed. It is also described how 3D printing enables critical sensor advantages including lower limit‐of‐detection, sensitivity, greater sensing range, and the ability for point‐of‐care diagnostics. Further, manufacturing itself benefits from 3D printing via rapid prototyping, improved resolution, and lower cost. This review provides researchers in academia and industry a comprehensive summary of the novel possibilities opened by the progress in 3D printing technology for a variety of biomedical applications.

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Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect

Cited by 65 publications

References 17 publications

Energy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication

Energy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication

Built-In Packaging for Single Terminal Devices

Recent Advances in 3D Printing of Biomedical Sensing Devices

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