Single Gate (SG) and Double Gate (DG) MOSFETs with strained and unstrained Si channel are studied using semi-classical Monte Carlo simulation to investigate the influence of ballistic electrons. We analyze how the intrinsic ballisticity B int , directly deduced from accurate counting of scattering events undergone by carriers in the channel, depends on channel length, channel doping, strain, MOS architectures and bias. Besides, we show that the intrinsic ballisticity B int seems to be a relevant parameter to explain the performance of small devices. It is highlighted that in undoped channels shorter than 50 nm, quasi-ballistic effects are responsible for a significant improvement in the on-current. However, for channel length smaller than about 30 nm (B int > 20%) the current tends to the ballistic limit and the increase in intrinsic ballisticity has a decreasing impact on the current.