2006
DOI: 10.1109/led.2006.873384
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Electrical signature of the defect associated with gate oxide breakdown

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Cited by 23 publications
(17 citation statements)
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“…As current leaks through the material, it leads to a runaway process that very rapidly results in damage to the material around the breakdown path, possibly through Joule heating [17]. The precise origin of trap generation remains the subject of debate, as does the nature of the traps which are responsible for the eventual breakdown [18]; impact ionization, hole injection, and trap creation involving atomic hydrogen are all possibilities [19].…”
Section: Introductionmentioning
confidence: 99%
“…As current leaks through the material, it leads to a runaway process that very rapidly results in damage to the material around the breakdown path, possibly through Joule heating [17]. The precise origin of trap generation remains the subject of debate, as does the nature of the traps which are responsible for the eventual breakdown [18]; impact ionization, hole injection, and trap creation involving atomic hydrogen are all possibilities [19].…”
Section: Introductionmentioning
confidence: 99%
“…Degradations have several sources: negative [4] and positive [5] bias temperature instability, hot carrier stresses [6], and oxide breakdown [5]. Negative Bias Temperature Instabilities (NBTI) generally leads to a shorter lifetime for pMOSFETs than that of nMOSFETs induced by hot carriers [7], and we concentrate on NBTI here.…”
Section: Introductionmentioning
confidence: 99%
“…This strong correlation supports that they originate from the same generation process. It is reported that the defects responsible for the intrinsic breakdown are the generated electron traps, rather than hole traps [23]. Hydrogenous species has been proposed to cause the generation [24] and one may speculate that the generated defect contains hydrogen.…”
Section: A Generated Defects (Gd): Characterization and Modellingmentioning
confidence: 99%