2011
DOI: 10.1116/1.3532544
|View full text |Cite
|
Sign up to set email alerts
|

Electrical characteristics of metal-insulator-semiconductor structures with atomic layer deposited Al2O3, HfO2, and nanolaminates on different silicon substrates

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
23
0

Year Published

2011
2011
2023
2023

Publication Types

Select...
8

Relationship

2
6

Authors

Journals

citations
Cited by 46 publications
(23 citation statements)
references
References 30 publications
0
23
0
Order By: Relevance
“…This technique allows the deposition of very thin layers by sequential selfterminating gas-solid reactions (Campabadal et al, 2011;Hausmann and Gordon, 2003). The sample structures were made on 100 mm diameter oriented p-type silicon wafers (1 0 0), with a resistivity of 4-40 cm.…”
Section: Substrate Fabricationmentioning
confidence: 99%
See 2 more Smart Citations
“…This technique allows the deposition of very thin layers by sequential selfterminating gas-solid reactions (Campabadal et al, 2011;Hausmann and Gordon, 2003). The sample structures were made on 100 mm diameter oriented p-type silicon wafers (1 0 0), with a resistivity of 4-40 cm.…”
Section: Substrate Fabricationmentioning
confidence: 99%
“…The sample structures were made on 100 mm diameter oriented p-type silicon wafers (1 0 0), with a resistivity of 4-40 cm. We have used the Savannah-200 ALD system set up at IMB-CNM (Campabadal et al, 2011), which consists of a thermal ALD system at a controlled temperature and under vacuum. The system uses deionized H 2 O as the oxygen precursor, together with tetrakis(dimethylamido)-hafnium for HfO 2 deposition and N 2 as the carrier/purging gas.…”
Section: Substrate Fabricationmentioning
confidence: 99%
See 1 more Smart Citation
“…Nevertheless, there is a trade-off between the dielectric constant and the insulator's critical electric field. For example, the critical electric field for SiO 2 is around 10 MV/cm while for HfO 2 is typically 2-3 MV/cm [25]. This is a detrimental factor for the use of HfO 2 if positive gate voltages are desired.…”
Section: Threshold Voltagementioning
confidence: 97%
“…24 The estimated equivalent oxide thickness (EOT) yields a relative dielectric constant j ¼ 7.4. 25 A SiO x interfacial layer (IL) was frequently reported as a sub-product of ALD layers growth on Si. 7, 26 We could not detect its presence through microscopy, neither through kinetics analysis.…”
mentioning
confidence: 99%