Effects of operating conditions on DMD hinge memory lifetime

Sontheimer, A.B.; Mehrl, David J.

doi:10.1109/relphy.2003.1197794

Cited by 7 publications

(6 citation statements)

References 4 publications

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“…Aluminium micro‐mirror hinges tilted in the same direction for long periods of time did not return to their original horizontal starting position when de‐activated 97,98,115 . The severity of the problem was found to be sensitive to the operating conditions, specifically temperature and the hinge on/off duty cycle 116 . It was found that during normal operation, the creep deformation or ‘hinge memory’ could be reduced or avoided by briefly tilting the mirror hinge in the opposite direction during switching.…”

Section: Experimental Characterizationmentioning

confidence: 99%

“…97,98,115 The severity of the problem was found to be sensitive to the operating conditions, specifically temperature and the hinge on/off duty cycle. 116 It was found that during normal operation, the creep deformation or 'hinge memory' could be reduced or avoided by briefly tilting the mirror hinge in the opposite direction during switching. In this way, hinge reliability has been improved by modifying the hinge activation and switching signals.…”

Section: Creepmentioning

confidence: 99%

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A review of deformation and fatigue of metals at small size scales

Connolley

McHugh

Bruzzi

2005

Fatigue Fract Eng Mat Struct

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A B S T R A C T Mechanical devices are being introduced whose size scale is well below that of conventional mechanical test specimens. The smallest devices have sizes in the nanometer range, though a good proportion of structural devices are of the micrometer scale. Development of these products raises the question of how their mechanical behaviour and reliability may be predicted. Conventional macroscopic test data can be used, but these are obtained using specimens whose size is much larger than the devices themselves. There is a risk that performance predictions will be inaccurate, due to the existence of size effects. This paper covers small size scale testing in metallic specimens and devices, concentrating on freestanding specimens. To begin, some examples of micro-scale devices are given. Fabrication methods for small metallic devices are then briefly described. This is followed by a review of experimental observations of mechanical properties in various metallic materials at the micro-scale, highlighting the differences in results from different research groups and the gaps in our current knowledge. A section on computational and predictive modelling is included, in recognition of the role of modelling in device design and testing. Overall, the findings are that size effects are common, particularly in crystalline samples when the grain size is similar to one or more of the specimen dimensions. However, observations of size effects differ between studies and mechanical properties can vary widely, even for the same type of material. As a consequence, the relationships between specific device processing methods, specimen size and material properties must be adequately understood to ensure successful performance. N O M E N C L A T U R EA = geometric texture factor b = Burgers vector magnitude d = grain diameter D f = fatigue ductility parameter E = elastic modulus h = film, foil or specimen thickness k = 'locking parameter,' representing the relative hardening contribution of grain boundaries K = constant for power law creep k B = Boltzmann constant l = specimen length n = Creep exponent for power law creep N f = number of cycles to failure p = constant in the Basquin and Coffin-Manson relationships

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Section: Experimental Characterizationmentioning

confidence: 99%

Section: Creepmentioning

confidence: 99%

A review of deformation and fatigue of metals at small size scales

Connolley

McHugh

Bruzzi

2005

Fatigue Fract Eng Mat Struct

View full text Add to dashboard Cite

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“…Creep can be a reliability concern for some types of MEMS, such as RF MEMS and Digital Micromirror Devices (DMDs) [82], [83], where long hold times at stressed states occur. Sontheimer [84], [85] attributed what is called the hinge memory phenomenon in DMDs, which refers to mirrors returning to a non-flat state as a result of metal creep of the hinge material even when the bias voltage is removed. Tregilgas [86] reported on the creep effect in aluminum thin films, which often serve as functional structures, such as hinges and joints in MEMS devices.…”

Section: Fatigue and Creepmentioning

confidence: 99%

MEMS Reliability Review

Huang

Vasan

Doraiswami

et al. 2012

IEEE Trans. Device Mater. Relib.

160

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Abstract-Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

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“…To our knowledge, there are no papers in the literature that have described the effect of temperature on the deformation of images displayed by the projectors used in 3D-structured light scanners. Some papers have described the effect of temperature on the aging effect of a projection matrix [47][48][49] or the effect of temperature on the quality parameters of the displayed images (e.g., contrast, intensity, reproduction of color, color temperature, and signal to noise ratio) [50,51].…”

Section: Introductionmentioning

confidence: 99%

Temperature Compensation Method for Mechanical Base of 3D-Structured Light Scanners

Adamczyk

Liberadzki

Sitnik

2020

Sensors

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The effect of temperature on three-dimensional (3D) structured light scanners is a very complex issue that, under some conditions, can lead to significant deterioration of performed measurements. In this paper, we present the results of several studies concerning the effect of temperature on the mechanical base of 3D-structured light scanners. We also propose a software compensation method suitable for implementation in any existing scanner. The most significant advantage of the described method is the fact that it does not require any specialized artifact or any additional equipment, nor access to the thermal chamber. It uses a simulation of mechanical base thermal deformations and a virtual 3D measurement environment that allows for conducting virtual measurements. The results from the verification experiments show that the developed method can extend the range of temperatures in which 3D-structured light scanners can perform valid measurements by more than six-fold.

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Effects of operating conditions on DMD hinge memory lifetime

Cited by 7 publications

References 4 publications

A review of deformation and fatigue of metals at small size scales

A review of deformation and fatigue of metals at small size scales

MEMS Reliability Review

Temperature Compensation Method for Mechanical Base of 3D-Structured Light Scanners

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