Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

“…Therefore, a highspeed ball pull test was also carried out on aged Sn-Pb, SAC105, SAC305, and SAC405 solder joints on Cu-OSP; the aging process was performed at 150 • C for 100 h to cause a noticeable microstructural change in IMC layers for comparison to multiple-reflowed samples and results from previous literature [11,[17][18][19]. Figs.…”

“…In particular, the Sn-Pb solder joint showed the largest decrease in fracture force from 650 g with fivetime reflows to 431 g after aging with complete transition from the mixed failure mode (59% brittle: 41% ductile) to 100% brittle failure mode, whereas the fracture force of the Sn-Ag-Cu solder alloys decreased by only 8-16% with some ductile failure mode observed, even after the aging process. A Cu 3 Sn IMC layer generally forms in the later stage of aging and thickens along with the thickening of the primary Cu 6 Sn 5 IMC layer on the Cu-OSP surface finish with increasing aging time [18,21]. This can affect the mechanical properties of both the Sn-Pb and Sn-Ag-Cu solder joints, which is due primarily to the increase in stress and voids in the IMC layers as the high-temperature aging process is continued [18,21].…”

Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

“…A high void density in the IMC layers can affect the mechanical properties of a solder joint because the initially random small voids can link together to develop into a crack with increasing aging time or reflow frequency, eventually leading to brittle fracture [32,33]. Second, boron might migrate to the grain boundaries in the IMC layers to strengthen the boundaries and impede grain growth, as was reported previously for examples of B-doped low carbon steel [34], Ni 3 Al [35,36], FeAl [37], in which boron migrated to the grain boundaries and strengthened them, simultaneously reducing the rate of grain growth.…”

Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint

“…[1][2][3][4][5][6][7] The most popular method to evaluate the mechanical reliability of the solder joints is the bump (or ball) shear test due to its simple and convenient implementation. 6,7) Many studies have been performed on various properties of Pb-free solder joints such as wetting, re ow, interfacial reactions, intermetallic compound (IMC) growth, bump/ball shear test, bending test, drop test, electromigration test, and other reliability tests. [1][2][3][4][5][6][7][8][9][10][11][12][13] However, corrosion reactions and their effect on the mechanical reliability of Pb-free solder joints are still uncertain.…”

“…6,7) Many studies have been performed on various properties of Pb-free solder joints such as wetting, re ow, interfacial reactions, intermetallic compound (IMC) growth, bump/ball shear test, bending test, drop test, electromigration test, and other reliability tests. [1][2][3][4][5][6][7][8][9][10][11][12][13] However, corrosion reactions and their effect on the mechanical reliability of Pb-free solder joints are still uncertain. Although the corrosion of solder alloys is not a major concern for electronic packages used in a normal environment, it may become a serious problem when they are used in an excessive moisture environment.…”