Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

You, Taehoon; Jung, Woo-Gwang; Moon, Jeong-Tak; Choe, Heeman

doi:10.1016/j.jallcom.2009.07.085

Cited by 21 publications

(15 citation statements)

References 16 publications

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“…However, this weakens the interface and reduces the ball shear strength and reliability. You et al 17 studied the reliability of eutectic Sn-Pb, Sn-1.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, and Sn-4.0Ag-0.5Cu solder alloys on three different pad surface finishes (ENIG, electrolytic Ni/Au, and OSP). The results showed that electrolytic Ni/Au surface finish had the highest fracture force for all three SAC solder alloys, whereas the average fracture force of the Sn-Pb solder joint was independent of the type of surface finish.…”

Section: Introductionmentioning

confidence: 99%

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Sona

Prabhu

2016

Journal of Elec Materi

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The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Nicoated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone (h gz ) was found to be a better parameter compared with the stabilized contact angle (h f ) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for leadfree solder alloys.

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Section: Introductionmentioning

confidence: 99%

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Sona

Prabhu

2016

Journal of Elec Materi

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“…This comparison was made because, in general, the fracture force decreases while the IMC thickness increases with increasing aging time. 3,15 Therefore, we examined the effect of the IMC thickness on the strength of the 0.1Y-doped SAC105. Figure 3 shows the dependence of the IMC thickness of the SAC105+0.1Y joint on aging time (0 h to 500 h) at 150°C, and the corresponding SEM images.…”

Section: Resultsmentioning

confidence: 99%

“…More importantly, compared to their Pb-containing counterparts, these solders have a significantly lower drop resistance, which poses a serious problem for a variety of promising mobile applications. 3,4 This resistance can be improved by increasing the elastic strain energy of the joint during high-speed tensile loading. In other words, the drop resistance can be increased by either reducing the Young's modulus of the solder material or increasing the high-speed fracture strength at the solder joint.…”

Section: Introductionmentioning

confidence: 99%

Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

Choi

Kaplan

Choe

2016

Journal of Elec Materi

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This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the significantly thicker intermetallic compound (IMC) formed at the solder joint, the 0.1 wt.% Y-doped joint exhibited a higher fracture strength than its baseline Sn-1.0Ag-0.5Cu counterpart under most aging and reflow conditions. This may be associated with the formation of Y-Cu IMCs formed at the interface between the solder and the Cu substrate, because the Y-Cu IMCs have recently been referred to as relatively 'ductile' IMCs.

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“…Lower wt.% of Ag in the alloys leads to brittle failure of the sample. The absence of Ag in Sn-0.7Cu alloy also results in ductile nature of the fracture of the sample [20][21][22].…”

Section: Resultsmentioning

confidence: 99%

Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Alam

Mishra

Kumar

2015

Materials Science-Poland

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Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

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Effect of surface finish on the fracture behavior of Sn–Ag–Cu solder joints during high-strain rate loading

Cited by 21 publications

References 16 publications

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

Effect of Ag on Sn–Cu and Sn–Zn lead free solders

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