2021
DOI: 10.1016/j.ceramint.2020.11.232
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Effect of plasma power on the structural properties of tin oxide prepared by plasma-enhanced atomic layer deposition

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Cited by 12 publications
(6 citation statements)
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“…The CLP number also increased as the power increased; however, at a power higher than 60 W a clear break of CLP was observed, possibly due to the degradation of MAPbI 3 induced by the excess oxygen ions, resulting in the swelling and destruction of the film surface associated with CO X [ 30 , 35 ]. These results are similar to those of some studies in surface or interfacial engineering via plasma treatment within chemical vapor disposition and atomic layer deposition [ 36 ]. Notably, the influence of oxygen ion bombardment gradually increased with increased power.…”
Section: Resultssupporting
confidence: 91%
“…The CLP number also increased as the power increased; however, at a power higher than 60 W a clear break of CLP was observed, possibly due to the degradation of MAPbI 3 induced by the excess oxygen ions, resulting in the swelling and destruction of the film surface associated with CO X [ 30 , 35 ]. These results are similar to those of some studies in surface or interfacial engineering via plasma treatment within chemical vapor disposition and atomic layer deposition [ 36 ]. Notably, the influence of oxygen ion bombardment gradually increased with increased power.…”
Section: Resultssupporting
confidence: 91%
“…The deposited rate is gained by the trade-off between the plasma bombardment etching effect and the full oxidation. It is interesting to note that this variation is also found in the deposition of tin oxide prepared by the same ALD system in our lab [26]. Figure 4a shows the measured wavelength-dependent refractive index spectra for the RP-ALD SiO 2 films with various plasma powers.…”
Section: Resultssupporting
confidence: 56%
“…The deposited rate is gained by the trade-off between the plasma bombardment etching effect and the full oxidation. It is interesting to note that this variation is also found in the deposition of tin oxide prepared by the same ALD system in our lab [ 26 ].…”
Section: Resultsmentioning
confidence: 61%
“…The ALD timing could be expressed as t 1– t 2– t 3– t 4, where t 1 is the first precursor's exposure time, t 2 is the purge time after the first exposure, t 3 is the exposure time of the second precursor, and t 4 is the purge time of the second precursor. Our previous research indicated that the timing for In 2 O 3 was 2–6–16–5 s and that for SnO 2 was 1.6–6–11–5 s. 23,24 Furthermore, In 2 O 3 could be deposited between 225 and 275 °C and SnO 2 could be deposited between 250 and 300 °C. In the present work, a substrate temperature of 250 °C was chosen to prepare ITO films since the ALD temperature windows of the component materials must overlap.…”
Section: Methodsmentioning
confidence: 96%
“…In our previous works, the properties of In 2 O 3 and SnO 2 films prepared using PEALD with InCp/O 2 plasma and TDMASn/O 2 plasma, respectively, have been studied individually. 23–26 In the present work, PEALD ITO films are prepared using a supercycle approach with a sequence of In 2 O 3 and SnO 2 subcycles. To our best knowledge, this is the first investigation of the ALD ITO films prepared from these precursor–oxidant combinations.…”
Section: Introductionmentioning
confidence: 99%