Effect of Interfacial Thermal Resistance on Effective Thermal Conductivity of MoSi&lt;SUB&gt;2&lt;/SUB&gt;/SiC Composites

Bai, Guangzhao; Jiang, Wan; Chen, Lidong

doi:10.2320/matertrans.47.1247

Cited by 16 publications

(6 citation statements)

References 10 publications

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“…For a low volume content of w ‐BN below 20 vol %, λ th exhibits an untypical decrease from 0.21 to 0.12 W/mK which are values below those of neat PI. Other authors have already observed such behavior in other nanocomposite materials . For a higher volume content of w ‐BN beyond 20 vol %, λ th increases up to 0.25 W/mK for 57.2 vol %.…”

Section: Resultsmentioning

confidence: 56%

Thermal conductivity of polyimide/boron nitride nanocomposite films

Diaham

Saysouk

Locatelli

et al. 2015

J of Applied Polymer Sci

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The thermal conductivity of polyimide/boron nitride (PI/BN) nanocomposite thin films has been studied for two sizes of BN nanofillers (40 and 120 nm) and for a wide range of content. A strong influence of BN particle size on the thermal conduction of PI has been identified. In the case of the largest nanoparticles (hexagonal-BN), the thermal conductivity of PI/h-BN (120 nm) increases from 0.21 W/mK (neat PI) up to 0.56 W/mK for 29.2 vol %. For the smaller nanoparticles (wurtzite-BN), PI/w-BN (40 nm), we observed two different behaviors. First, we see a decrease until 0.12 W/mK for 20 vol % before increasing for higher filler content. The initial phenomenon can be explained by the Kapitza theory describing the presence of an interfacial thermal resistance barrier between the nanoparticles and the polymer matrix. This is induced by the reduction in size of the nanoparticles. Modeling of the experimental results allowed us to determine the Kapitza radius a K for both PI/h-BN and PI/w-BN nanocomposites. Values of a K of 7 nm and >500 nm have been obtained for PI/h-BN and PI/w-BN nanocomposite films, respectively. The value obtained matches the Kapitza theory, particularly for PI/w-BN, for which the thermal conductivity is expected to decrease compared to that of neat PI. The present work shows that it seems difficult to enhance the thermal conductivity of PI films with BN nanoparticles with a diameter <100 nm due to the presence of high interfacial thermal resistance at the BN/PI interfaces. V C 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015, 132, 42461.

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Section: Resultsmentioning

confidence: 56%

Thermal conductivity of polyimide/boron nitride nanocomposite films

Diaham

Saysouk

Locatelli

et al. 2015

J of Applied Polymer Sci

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“…In addition, interfacial imperfections, induced by the mismatch of the thermal expansion coefficient between alumina and SiC nanoparticles, also affect the thermal conductivity of the composites. 48 In our study, the high aspect ratio of MWNTs and probably the enhanced connectivity achieved in a hybrid filler have reduced this value to only 3 vol% for the alumina matrix. 46,47 The decrease in the thermal conductivity of the composites by addition of SiC due to interface thermal resistance has also been reported earlier.…”

Section: Wwwceramicsorg/actmentioning

confidence: 57%

“…Thus lowering the interface density or in turn interface resistance that may result in increase of thermal conductivity as reported for 30 vol% SiC/MoSi 2 composites. 48 In our study, the high aspect ratio of MWNTs and probably the enhanced connectivity achieved in a hybrid filler have reduced this value to only 3 vol% for the alumina matrix. Because of the intragranular fracture mode of the hybrid nanocomposites, it is somewhat difficult to show the hybrid percolation network at the grain boundaries.…”

Section: Wwwceramicsorg/actmentioning

confidence: 57%

“…46,47 The decrease in the thermal conductivity of the composites by addition of SiC due to interface thermal resistance has also been reported earlier. 48 The combined effect of low thermal conductivity of CNT ropes, interface thermal resistance, or Kapitza resistance between the alumina matrix and MWNTs/SiC due to scattering of phonon may be the possible causes of decreases in thermal conductivities for 1 and 2 vol% of SiC-reinforced hybrid alumina composites. At 3 vol% of SiC, the intrinsically high thermal conductivity of SiC may dominate the interfacial resistance and thermal conductivity starts increasing.…”

Section: Wwwceramicsorg/actmentioning

confidence: 99%

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Multifunctional Properties of Alumina Composites Reinforced by a Hybrid Filler

Ahmad

Pan

Zhi

2009

Int J Applied Ceramic Tech

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Hybrid microstructure design has been used to fabricate alumina composites reinforced by 5 vol% of multiwalled carbon nanotube (MWNT) together with different (1, 2, 3 vol%) contents of SiC nanoparticles by spark plasma sintering. The mechanical, thermal, and electrical properties of the composites were determined as a function of the SiC volume fraction. The thermal conductivity decreased for 1 and 2 vol% of SiC, while for 3 vol%, it increased. Substantial improvements in the fracture toughness, bending strength, and electrical conductivity were observed and attributed to a synergetic effect of the MWNT and SiC nanoparticles in the hybrid microstructure design.

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“…High quality joints of this type are obtained by careful surface preparation and application of advanced manufacturing techniques, like chemical or physical vapour deposition [4,5]. To characterize the heat transfer through the boundary between solids remaining in direct contact the notion of interfacial thermal resistance (ITR) is utilized [3,6]. Apart from thermal contact resistance related to poor mechanical and chemical bonding it includes thermal boundary resistance (TBR) influence which results from the differences in conductive characteristics of contacting media such as velocities and densities of heat carriers [1,6,7].…”

Section: Introductionmentioning

confidence: 99%

Application of flash method in the measurements of interfacial thermal resistance in layered and particulate composite materials

2017

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Presented study concerns the possibility of evaluation of interfacial thermal resistance (ITR) between the constituents in composite materials with the use of flash technique. Two variants of such measurement are considered, the first of which is the measurement of ITR between two bonded layers of different materials which had been studied before by various researchers. The second tested measurement method is targeted at determination of ITR in particulate composites with low and moderate filler content based on their effective thermal conductivity. Method of such measurement is proposed and tested on two cases of particle-filled polymer composites. Positive verification results were obtained for polymer/glass composite in which the difference between thermal conductivities of matrix and filler is low. For a polymer filled with aluminum particles the evaluation of average ITR in the samples was impossible as the effective medium models applied in the method strongly underestimated the thermal conductivity of that material. The investigation confirmed the need for more accurate methods of macroscopic thermal properties prediction for composite media with high contrast of thermal conductivities of the constituents. Extended literature study suggests that the method can be applicable to selected classes of engineering materials.

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Effect of Interfacial Thermal Resistance on Effective Thermal Conductivity of MoSi<SUB>2</SUB>/SiC Composites

Cited by 16 publications

References 10 publications

Thermal conductivity of polyimide/boron nitride nanocomposite films

Thermal conductivity of polyimide/boron nitride nanocomposite films

Multifunctional Properties of Alumina Composites Reinforced by a Hybrid Filler

Application of flash method in the measurements of interfacial thermal resistance in layered and particulate composite materials

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