Effect of Ce on resistivity of Sn-3.8Ag-0.7Cu-xCe lead-free solders

Abstract

2015): Effect of Ce on resistivity of Sn-3.8Ag-0.7Cu-xCe lead-free solders, Physics and Chemistry of Liquids, ABSTRACTThe electrical resistivity of Sn-3.8Ag-0.7Cu-xCe (x takes 0, 0.2, 0.5 and 1.0 weight per cent) alloy as a function of temperature was measured by DC four-probe technique. Abnormal changes occurred on the resistivity-temperature (ρ-T) curves above the liquidus, which suggested that the temperature-induced liquid-liquid structure transition probably occurred in Sn-3.8Ag-0.7Cu-xCe melt, with some reversible characters. With the increasing of Ce, the melting range was expanded from 13.0°C to 24.2°C, and the resistivity increased sharply when the Ce composition increased to 0.2%, and then declined slightly. In addition, the temperature and behaviour of abnormal zone were affected by the different additions of Ce. ARTICLE HISTORY

Viscosity and Electrical Conductivity of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Admixtures

“…Much less studies are devoted to the influence of minor metal additions on thermophysical properties of liquid Sn-based alloys, in particular, of SAC alloys (Ref 16, 17). Experimental data of structure-sensitive thermophysical properties, such as viscosity and electrical conductivity, are required for mathematical models and simulations describing solidification and soldering processes.…”