Viscosity and Electrical Conductivity of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Admixtures

Yakymovych, A.; Sklyarchuk, V.; Plevachuk, Yu.; Sokoliuk, B.

doi:10.1007/s11665-016-2297-8

Cited by 12 publications

(4 citation statements)

References 32 publications

(27 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The viscosity of liquid phase is taken in accordance to Ref. [27], whereas solid phases are chosen as regions of very high viscosities [25]. The free energy of the system is defined as the volume integral of free energy density [28]: The free energy densities of Cu, Sn and IMC (η) phases at 250 • C are numerically evaluated in accordance to the values presented in Fig.…”

Section: Materials and Experimentsmentioning

confidence: 99%

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Shang

Kunwar

Wang

et al. 2019

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

The growth behaviour of Cu 6 Sn 5 intermetallic compound (IMC) at the solder height controlled post-spread Sn/Cu interface is investigated for different initial solder ball volumes, reflow temperatures and cooling rates. Because of the limited solder thickness at the periphery, the IMC retains a preferential scalloped morphology, even after cooling. For solder balls of initial diameters of 500, 1000 and 1700 µm, with the maximum solder height at the peripheral regime not exceeding 150 µm, reflowed at 250 ℃ and undergoing air cooling, it has been revealed that IMC characterized with larger layer thickness and grain diameter, correspond to the sample of smaller ball size. The increase in reflow temperature for a solder of initial size of 500 µm, is characterized by the increase in IMC thickness, developments of few but quite large faceted planes over the original scalloped morphology and non-uniformity in the grain diameter. In contrary the to air cooling (cooling rate 4.0 K/s), the IMCs obtained at the thin film zone, for furnace cooling (cooling rate = 0.037 K/s), are very larger, both in grain size and layer thickness. Moreover, the scalloped Cu 6 Sn 5 surface in furnace cooled specimens, bear many but tiny

show abstract

Section: Materials and Experimentsmentioning

confidence: 99%

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Shang

Kunwar

Wang

et al. 2019

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…(10 equations describing its dependence on temperature are collected in Table 7 for all studied models. As an example, Fig.…”

Section: Density In the Liquid Sn-ag-cu Ternary Alloysmentioning

confidence: 99%

Theoretical investigation of some physicochemical properties in the liquid Sn–Ag–Cu alloys

M’chaar

Sabbar

Moudane

et al. 2017

J. Theor. Comput. Chem.

View full text Add to dashboard Cite

Some physicochemical properties such as surface tension, molar volume, density and viscosity of liquid Sn-Ag-Cu alloys have been calculated using Kohler, Muggianu, Toop and Hillert geometrical models along three cross-sections namely x Ag /x Cu ¼ 1=2, 1/1 and 2/1. Indeed, Guggenheim, Kozlov-Romanov-Petrov and Kaptay equations have also been extended to estimate the surface tension and viscosity based on the thermodynamic data of the investigated system over wide temperature ranges of 823-1123 K and 773-1173 K, respectively. The results show that the three investigated properties, surface tension, density and viscosity, decrease with increasing tin for all studied models. On the other hand, a di®erent behavior of these properties as a function of the temperature was noted. This evolution depends on the composition of the studied alloys.On the contrary, the molar volume increases with increase of temperature and tin compositions. It should be noted that the surface tension, density and molar volume show a linear dependence on temperature for all the investigated compositions. For viscosity, a curvilinear dependence has been observed. The calculated surface tensions and densities were compared with those reported experimentally for Sn-Ag-Cu alloys along the cross-section x Ag /x Cu ¼ 1/1.

show abstract

“…It is also expected that metal nanoparticles will be dissolved during the soldering process and their atoms will replace the Cu atoms in the Cu-Sn IMCs, directly impacting their morphology and the growth rate of the IMCs, while solid metal (M) additions in bulk could chemically react with the liquid Sn-based matrix and form M-Sn IMCs instead. Recently, several efforts have been made to develop a new generation of Pb-free solders by minor additions of various nanosized impurities, such as ceramic or metal nanoparticles, into commercial SAC solders [9][10][11][12][13]. It was shown that the TiO 2 particles were incorporated at the Sn grain Metals 2023, 13, 1093 2 of 10 boundaries in reinforced 99Sn0.3Ag0.7Cu-TiO 2 composite solders at both the interface of the intermetallic layer and in the solder bulk [10].…”

Section: Introductionmentioning

confidence: 99%

“…The transport properties and microstructure of the liquid SAC alloys with Co impurities were investigated in Ref. [12], while the extra heat effects of nanosized Ni addition into the liquid Sn-3.8Ag-0.7Cu (SAC387) solder compared to the bulk material were investigated in Ref. [13].…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Yakymovych

Shtablavyi

2023

Metals

View full text Add to dashboard Cite

The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural analysis of the investigated samples were performed by means of X-ray diffraction in a liquid state and scanning electron microscopy (SEM). SEM showed the mutual substitution of Ni and Cu atoms in the Cu6Sn5 and Ni3Sn4 phases, respectively. The performed structural studies in liquid and solid states provided essential information concerning the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor additions of nanosized Ni powder. The melting point and degree of undercooling of the samples were investigated by DTA analysis.

show abstract

Viscosity and Electrical Conductivity of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Admixtures

Cited by 12 publications

References 32 publications

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface

Theoretical investigation of some physicochemical properties in the liquid Sn–Ag–Cu alloys

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Contact Info

Product

Resources

About