Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

“…Similar to our previous studies dealing with nanocomposite SAC solder joints with metal and ceramic nanoadditions, 8,9 a Cu 6 Sn 5 /Cu 3 Sn double layer was observed at the solder/Cu interface. It was found that Ni atoms were incorporated into the Cu 6 Sn 5 crystals, both in the bulk solder and in the interfacial layer, while no regions with either pure Ni or Ni-Sn IMCs could be seen in the joints.…”

“…Furthermore, the additions of NPs to the SAC solders lead to an enhancement of the shear strength, microhardness, wettability and of other properties. [9][10][11] In all these studies, it was shown that the additions of different kinds of NPs to the SAC solders lead, in principle, to similar effects. However, the behavior of the employed ceramic nanoinclusions in the Sn-based matrix is fundamentally different from that of metallic NPs: metal NPs are dissolved during the soldering process and act through an alloying effect while ceramic NPs act as nuclei for heterogeneous nucleation.…”

“…For instance, a paste and flux mixing method was applied to prepare solders in paste form or as nanocomposite flux-solder mixture, respectively. 7,8,13,14 A conventional planar flow casting 9,15 as well as a roll bonding method 16 have been used to fabricate nanocomposite solder ribbons. The mixing methods are the most popular ones due to the relatively simple experimental procedure; however, during the reflow process the NPs tend to move with the flux, and it is very difficult to estimate the amount of nanoinclusions actually remaining in the solder.…”

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

“…The increasing scientific interest for Sn-based nanocomposite alloys with small additions of various metals, [1][2][3][4] oxides [5][6][7][8] and carbon [9][10][11][12] in nanosized form relates to the possible application of these materials as an alternative to commercial lead-free solders. As pointed out in two literature reviews, [13,14] improved mechanical properties and a reinforced microstructure of solder joints using nanocomposite Sn-Ag-Cu (SAC) alloys compared to those without nanoinclusions, revealed new possibilities for the development of currently used commercial lead-free solders.…”

The nano heat effect of replacing macro-particles by nano-particles in drop calorimetry: the case of core/shell metal/oxide nano-particles

“…For instance, in order to promote new enhanced and customer-friendly lead-free solders, nanocomposite Snbased alloys with minor additions of metal nanoparticles have been under intensive scientic examination. [11][12][13] Unfortunately, most of these studies refer to mechanical properties [14][15][16][17][18] while information related to thermophysical and thermodynamic properties as well as structural features, especially in the liquid state, is scarce. [19][20][21] However, a possible industrial use requires comprehensive data on new nanosized materials with precisely controlled properties.…”