Effect of additives on the co-electrodeposition of Sn–Ag–Cu lead-free solder composition

Joseph, Shany; Phatak, Girish

doi:10.1016/j.mseb.2010.01.017

Cited by 20 publications

(29 citation statements)

References 14 publications

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“…In an aqueous solution, the difference between the reduction potential for the two metals is 0.62 V [17], which makes aqueous baths far from ideal to co-deposit Zn (II) and Sn (II) [8]. Changing the aqueous solution with ethaline, the difference between the reduction potential of Sn (II) and Zn (II) is decreased in 40 mV to 0.58 V. A larger effect is obtained when the concentration of Idranal VII is such as to allow the full complexation of Sn (II) in solution; the difference in the Zn (II) and Sn (II) peak potential is very small.…”

Section: Deposition Of Zn-snmentioning

confidence: 99%

“…In general, it is necessary the application of high overpotentials which leads to dendritic deposits [7]. An ideal co-deposition bath should deposit all the elements at a single or in a narrow range of potentials [8]. For the Sn-Zn system, a large potential difference is observed in the reduction potential so it is necessary to add appropriate chelating agents to bring the deposition potentials closer.…”

Section: Introductionmentioning

confidence: 99%

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Zn–Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII

et al. 2012

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The use of deep eutectic solvents for metal electrodeposition has become an area of interest in the recent years. In this study, ethaline, propeline, and reline were used as solvents for the electrodeposition of Sn-Zn alloys. Ethaline, propeline, and reline displayed identical voltammetric profiles for the reduction of Zn(II) and Sn(II). Further studies were carried out in ethaline which is the liquid with lowest viscosity. To improve physical and morphological properties of the Sn-Zn deposits, additives were added to the ionic liquid solution. In this study, the addition of three chelators (EDTA, HEDTA, and Idranal VII) and their effects on the voltammetric behavior of zinc and tin and the resultant morphology was described. The structure and composition of the Zn-Sn deposit was largely affected by the additives with the largest effect being obtained in the presence of Idranal VII.

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Section: Deposition Of Zn-snmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Zn–Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII

et al. 2012

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“…The similar results are reported by others authors. 28,31,39 The equivalent circuit which fitted the experimental data is depicted in Fig. 5.…”

Section: Kinetics Studymentioning

confidence: 99%

“…The effect of TU on the morphology and microstructure of tin and tin alloys have been studied. 15,28 Only very few reports discussed the effect of TU on the tin nucleation from a sulphate bath. 31 However, and as far as we know, no investigation has been made on the nucleation mechanism of tin from chloride baths in the presence of TU.…”

Section: Introductionmentioning

confidence: 99%

Effects of thiourea on the kinetics and electrochemical nucleation of tin electrodeposition from stannous chloride bath in acidic medium

Kesri¹,

Affoune²,

Djaghout³

2019

JSCS

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The effects of thiourea (TU) on the kinetics and electrochemical nucleation of tin from stannous chloride bath in acidic medium have been investigated by cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS) and chronoamperometry. CV results showed that the tin reduction is a one-step reaction and indicated that TU inhibited the reduction of tin ions at high concentration. EIS analysis showed that the electrodeposition process of tin is affected by the addition of TU. The nucleation mechanism of tin was studied using both Sharifker-Hills (SH) and Palomar-Pardavé (PP) models. SH model indicated that hydrogen evolution and tin reduction occurred simultaneously. Non-dimensional current-time transients curves based on PP model revealed that the tin nucleation followed 3D progressive mechanism without TU and with 0.01 M TU, while the nucleation process changes to 3D instantaneous in presence of 0.1 M TU. However, at 1 M TU, the nucleation mechanism is located between instantaneous and progressive model. The proton reduction reaction was inhibited at all concentrations of TU. Quantitative determination showed that in the presence of TU, the diffusion coefficient of tin species, the hydrogen evolution rate constant, the nucleation rate constant and the number of active sites were decreased.

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“…The drive for development of lead-free solder is towards system that can replicate conventional lead containing alloy behavior besides fulfill the following requirements: good wettability, low melting temperature, good mechanical properties, good resistance to mechanical and thermal fatigue, corrosion resistance, good electrical properties, health and environment friendly, easy availability and low material cost [2].…”

Section: Introductionmentioning

confidence: 99%

Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

2013

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-Nanostructured lead-free solder Sn-Ag-Cu (SAC) was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA) based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM). In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed.

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Effect of additives on the co-electrodeposition of Sn–Ag–Cu lead-free solder composition

Cited by 20 publications

References 14 publications

Zn–Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII

Zn–Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII

Effects of thiourea on the kinetics and electrochemical nucleation of tin electrodeposition from stannous chloride bath in acidic medium

Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

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