pH control is significant in electrodeposition because they affect the characteristics of electrolyte and the deposit. This paper mainly analyses the processing conditions of electrolyte pH value on the electrodeposited SAC. Sn2+ ions will be obtained from the tin methane sulphonate acid while the Cu2+ and Ag+ ions will be obtained from their respective sulfate salts. Ammonium acetate helps in raising the pH of the bath. The FESEM analysis was carried out to examine the morphology of the electrodeposited nanocomposites. A variety of morphological patterns for the electrodeposits with different electrolyte pH is obtained. At low pH (2) electrolyte value, the electrodeposits show a very poor quality with rough surface. With increasing pH value (2.5), the averaged grain sizes decreased. The surfaces of the films electrodeposited at this pH value are generally quite smooth, uniform and compact. Later increment of pH values (3~4) has lead to the formation of porous and non-uniform electrodeposits. From the study, it is possible to observe that, even with the same composition, the deposits have different morphologies under different controlled parameter.
-Nanostructured lead-free solder Sn-Ag-Cu (SAC) was developed by electrodeposition method at room temperature. Electrolite bath which comprised of the predetermined quantity of tin methane sulfonate, copper sulfate and silver sulfate were added sequentially to MSA solution. The methane sulphonic acid (MSA) based ternary Sn-Ag-Cu bath was developed by using tin methane sulfonate as a source of Sn ions while the Cu+ and Ag+ ions were obtained from their respective sulfate salts. The rate of the electrodeposition was controlled by variation of current density. The addition of the buffer, comprising of sodium and ammonium acetate helped in raising the pH solution. During the experimental procedure, the pH of solution, composition of the electrolite bath, and the electrodeposition time were kept constant. The electrodeposited rate, deposit composition and microstructure were investigated as the effect of current density. The electrodeposited solder alloy was characterized for their morphology using Field Emission Scanning Electron Microscope (FESEM). In conclusion, vary of current density will play significant role in the surface morphology of nanostructured lead-free solder SAC developed.
With world-wide strict legislation for reduction or removal of lead from industrial waste, development of a large number of lead-free alternative solder materials had been intensively examined. The drive for lead-free solders development was towards systems that can imitate conventional lead containing solder alloys in terms of melting temperatures and improvement of mechanical properties. Nanostructured solder alloy, with a grain size of typically < 100 nm, was a new class of materials with properties distinct from and frequently distinguished to those of the conventional alloy. In comparison, nanostructured solder alloys exhibit higher strength and hardness, enhanced diffusivity, and excellent soft and hard magnetic properties. Numerous different techniques were performed to synthesize these nanostructured solder alloys. Electrodeposition method has generated huge interest in nanostructured solder preparation, mainly due to its ability to deposit solders selectively and uniformly at nanoscale. These factors bring significant influences on the behaviors of products, such as magnetization, density, ductility, wear resistance, corrosion resistance, porosity, molecular structure, and crystal properties which plays a vital part in the field of electronic manufacturing. In this paper, a short review on the electrodeposition, a useful technique to deposit different metals and alloys, as a method for nanostructured lead-free solder alloys preparation is presented.
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