Abstract:With world-wide strict legislation for reduction or removal of lead from industrial waste, development of a large number of lead-free alternative solder materials had been intensively examined. The drive for lead-free solders development was towards systems that can imitate conventional lead containing solder alloys in terms of melting temperatures and improvement of mechanical properties. Nanostructured solder alloy, with a grain size of typically < 100 nm, was a new class of materials with properties dist… Show more
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