Drop impact reliability testing for lead-free and lead-based soldered IC packages

Chong, D.Y.R.; Che, F.X.; Pang, J.H.L.; Ng, Kellin; Tan, J.Y.N.; Low, P.T.H.

doi:10.1016/j.microrel.2005.10.011

Cited by 145 publications

(50 citation statements)

References 11 publications

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“…Moreover, defining accurate loading conditions for the MEMS (e.g. in terms of reference acceleration values, and frequency content Li and Shemansky 2000;Srikar and Senturia 2002;Baker and Pohl 2005;Chong et al 2006;Hauck et al 2006;Younis et al 2007;Jordy and Younis 2008;Kimberley et al 2009) is not trivial. To accurately link shock or drop features to sensor failure, in Mariani et al (2007); Mariani et al (2008); , Corigliano et al (2008), , we proposed a fully numerical, multi-scale approach specifically devised for polysilicon inertial MEMS sensors.…”

Section: Introductionmentioning

confidence: 99%

Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks

et al. 2010

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In this work we exploit a multi-scale framework to model the shock-induced failure of polysilicon micro electro-mechanical systems (MEMS), and study the impact of uncertainties at polycrystal length-scale on the results. Because of polysilicon brittleness, MEMS sensors almost instantaneously fail by micro-cracking when subjected to shocks. Since the length of the zone where such micro-cracking is spreading can amount to 5-10% of the characteristic grain size, the morphology of polysilicon films constituting the movable parts of the MEMS is explicitly modeled at the micro-scale within a cohesive approach. Focusing on shocks induced by accidental drops, forecasts of MEMS failure are obtained through a Monte Carlo methodology, wherein statistics of the polycrystalline morphology are accounted for. Outcomes, in terms of failure mode and drop height leading to failure, are shown to correctly represent available experimental evidences relevant to a commercial micro-device.

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Section: Introductionmentioning

confidence: 99%

Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks

et al. 2010

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“…There has been a significant amount of research done in the last few years on drop impact reliability [1][2][3][4][5][6][7][8][9][10]. The JEDEC standard JESD22-B111 [11] for the board level and related standards [12,13] for the subassembly level have been developed for drop testing handheld electronics.…”

Section: Introductionmentioning

confidence: 99%

Drop impact reliability of edge-bonded lead-free chip scale packages

Farris¹,

Pan²,

Liddicoat³

et al. 2009

Microelectronics Reliability

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a b s t r a c tThis paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test boards were subjected to drop tests at several impact pulses, including a peak acceleration of 900 Gs with a pulse duration of 0.7 ms, a peak acceleration of 1500 Gs with a pulse duration of 0.5 ms, and a peak acceleration of 2900 Gs with a pulse duration of 0.3 ms. A high-speed dynamic resistance measurement system was used to monitor the failure of the solder joints. Two edge-bond materials used in this study were a UV-cured acrylic and a thermal-cured epoxy material. Tests were conducted on CSPs with edge-bond materials and CSPs without edge bonding. Statistics of the number of drops-to-failure for the 15 component locations on each test board are reported. The test results show that the drop test performance of edge-bonded CSPs is five to eight times better than the CSPs without edge bonding. Failure analysis was performed using dyepenetrant and scanning electron microscopy (SEM) methods. The most common failure mode observed is pad lift causing trace breakage. Solder crack and pad lift failure locations are characterized with the dye-penetrant method and optical microscopy.

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“…An accidental impact might cause severe damage to electronic products, such as mobile phones, personal digital assistants (PDAs), and MP3 players, which are susceptible to being dropped. [1][2][3] Meanwhile, since usage of Pb has been prohibited and the mechanical properties of leadfree solders have been widely researched, Sn-Ag-Cubased alloys have commonly been considered as the most reasonable substitutes. However, the promising solders appear to be stronger and stiffer than the conventional Sn-Pb solders, so solder joints made from these materials might be easier to destroy when the device is subjected to a sudden load.…”

Section: Introductionmentioning

confidence: 99%

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

Zhang

Shi

Liu

et al. 2009

Journal of Elec Materi

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This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for 100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the Sn/Cu 6 Sn 5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed.

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Drop impact reliability testing for lead-free and lead-based soldered IC packages

Cited by 145 publications

References 11 publications

Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks

Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks

Drop impact reliability of edge-bonded lead-free chip scale packages

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

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