2006
DOI: 10.1016/j.microrel.2005.10.011
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Drop impact reliability testing for lead-free and lead-based soldered IC packages

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Cited by 146 publications
(53 citation statements)
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“…Moreover, defining accurate loading conditions for the MEMS (e.g. in terms of reference acceleration values, and frequency content Li and Shemansky 2000;Srikar and Senturia 2002;Baker and Pohl 2005;Chong et al 2006;Hauck et al 2006;Younis et al 2007;Jordy and Younis 2008;Kimberley et al 2009) is not trivial. To accurately link shock or drop features to sensor failure, in Mariani et al (2007); Mariani et al (2008); , Corigliano et al (2008), , we proposed a fully numerical, multi-scale approach specifically devised for polysilicon inertial MEMS sensors.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, defining accurate loading conditions for the MEMS (e.g. in terms of reference acceleration values, and frequency content Li and Shemansky 2000;Srikar and Senturia 2002;Baker and Pohl 2005;Chong et al 2006;Hauck et al 2006;Younis et al 2007;Jordy and Younis 2008;Kimberley et al 2009) is not trivial. To accurately link shock or drop features to sensor failure, in Mariani et al (2007); Mariani et al (2008); , Corigliano et al (2008), , we proposed a fully numerical, multi-scale approach specifically devised for polysilicon inertial MEMS sensors.…”
Section: Introductionmentioning
confidence: 99%
“…There has been a significant amount of research done in the last few years on drop impact reliability [1][2][3][4][5][6][7][8][9][10]. The JEDEC standard JESD22-B111 [11] for the board level and related standards [12,13] for the subassembly level have been developed for drop testing handheld electronics.…”
Section: Introductionmentioning
confidence: 99%
“…An accidental impact might cause severe damage to electronic products, such as mobile phones, personal digital assistants (PDAs), and MP3 players, which are susceptible to being dropped. [1][2][3] Meanwhile, since usage of Pb has been prohibited and the mechanical properties of leadfree solders have been widely researched, Sn-Ag-Cubased alloys have commonly been considered as the most reasonable substitutes. However, the promising solders appear to be stronger and stiffer than the conventional Sn-Pb solders, so solder joints made from these materials might be easier to destroy when the device is subjected to a sudden load.…”
Section: Introductionmentioning
confidence: 99%