Drop impact reliability of edge-bonded lead-free chip scale packages

Farris, Andrew; Pan, Jianbiao; Liddicoat, Albert A.; Krist, Michael; Vickers, Nicholas; Toleno, Brian J.; Maslyk, Dan; Shangguan, Dongkai; Bath, Jasbir; Willie, Dennis; Geiger, David

doi:10.1016/j.microrel.2009.05.003

Cited by 14 publications

(6 citation statements)

References 23 publications

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“…The simulation of drop test is performed by neglecting the damping. The results are consistent with the literature regarding the dynamic response of the system and the stress distribution [2]. These results show that solder balls at the corners of the components are under the greatest stress and that if there was failure, it would manifest itself as a crack behind the ball, that is to say the border or at the interface with the PCB (Figure 3).…”

Section: Methodssupporting

confidence: 91%

Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)

Assif

Mohamed

Hami

et al. 2011

AMR

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Increasing demand for smaller consumer electronic devices with multi-function capabilities has driven the packaging architectures trends for the finer-pitch interconnects, thus increasing chances of their failures. A simulation of the Board Level Drop-Test according to JEDEC (Joint Electron Device Council) is performed to evaluate the solder joint reliability under drop impact test. After good insights to the physics of the problem, the results of the numerical analysis on a simple Euler-Bernoulli beam were validated against analytical analysis. Since the simulation has to be performed on ANSYS Mechanical which is an implicit software, two methods were proposed, the acceleration-input and the displacement-input. The results are the same for both methods. Therefore, the simulation is carried on the real standard model construction of the board package level2. Then a new improved model is proposed to satisfy shape regular element and accuracy. All the models are validated to show excellent first level correlation on the dynamic responses of Printed Circuit Board, and second level correlation on solder joint stress. Then a static model useful for quick design analysis and optimization’s works is proposed and validated. Finally, plasticity behavior is introduced on the solder ball and a non-linear analysis is performed.

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Section: Methodssupporting

confidence: 91%

Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)

Assif

Mohamed

Hami

et al. 2011

AMR

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“…15, and it is the tension which results in joint fracture [5]. The failure modes reported [6] include pad cratering (83.3%), I/O trace fracture (73.3%), board side solder crack (33.3%), daisy chain trace fracture (3.3%), and chip side solder crack (1.7%) in terms of percentage of analyzed components. Study of Srinivas shows the failure rate of bottom joints is higher than top joints for PoP upon drop [7].…”

Section: Failure Modes Upon Dropmentioning

confidence: 99%

Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly

Lee

2011

International Symposium on Microelectronics

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Package on package (PoP) is a packaging that rapidly prevails in mobile devices of the electronic industry, due to its flexibility in combining memory and processor into one component with a reasonably low profile. However, similar to BGA, the solder joints of assembled PoP are prone to cracking upon dropping onto the floor, thus needing reinforcement by underfilling. The underfilling process needs an underfill material plus additional dispensing equipment, dispensing and flowing steps, and subsequent time-consuming curing. Furthermore, underfilled PoP suffers solder extrusion upon rework, particularly when reworking at the opposite side of the board right underneath the PoP. Epoxy flux is a new material developed to address the issues described above. It is a liquid epoxy with fluxing power, and it is compatible with solder paste. Applied by a dipping process, epoxy flux can be used at the mounting of bottom package and top package. First, the bottom package is dipped in a film of epoxy flux, and then placed onto the footprint pad on a PCB with or without solder paste. Then, the top package is dipped in epoxy flux and placed on top of the bottom package. The PCB with a stacked PoP is subsequently reflowed in the oven together with other surface mount components placed on printed solder paste. Epoxy flux combines soldering and reinforcement into one single process. With a controlled pick up flux volume, a venting channel is formed, allowing outgassing at reflow. The low stress characteristics of epoxy flux prevents the formation of solder extrusion. Overall, epoxy flux provides a low cost and high reliability solution for PoP assembly.

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“…Today’s manufacturing industry is rapidly evolving to provide competitive products [ 6 , 22 ]. This product development is also improving in parallel with new technologies nowadays [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

Sustainable Packaging Design for Molded Expanded Polystyrene Cushion

et al. 2023

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A molded expanded polystyrene (EPS) cushion is a flexible, closed-cell foam that can be molded to fit any packing application and is effective at absorbing shock. However, the packaging waste of EPS cushions causes pollution to landfills and the environment. Despite being known to cause pollution, this sustainable packaging actually has the potential to reduce this environmental pollution because of its reusability. Therefore, the objective of this study is to identify the accurate design parameter that can be emphasized in producing a sustainable design of EPS cushion packaging. An experimental method of drop testing and design simulation analysis was conducted. The effectiveness of the design parameters was also verified. Based on the results, there are four main elements that necessitate careful consideration: rib positioning, EPS cushion thickness, package layout, and packing size. These parameter findings make a significant contribution to sustainable design, where these elements were integrated directly to reduce and reuse packaging material. Thus, it has been concluded that 48 percent of the development cost of the cushion was decreased, 25 percent of mold modification time was significantly saved, and 27 percent of carbon dioxide (CO₂) reduction was identified. The findings also aided in the development of productive packaging design, in which these design elements were beneficial to reduce environmental impact. These findings had a significant impact on the manufacturing industry in terms of the economics and time of the molded expanded polystyrene packaging development.

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Drop impact reliability of edge-bonded lead-free chip scale packages

Cited by 14 publications

References 23 publications

Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)

Numerical Model to Simulate the Drop Test of Printed Circuit Board (PCB)

Epoxy Flux – A Low Cost High Reliability Approach for PoP Assembly

Sustainable Packaging Design for Molded Expanded Polystyrene Cushion

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