Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies

Zhang, Yan; Liu, Changqing; Whalley, D.C.

doi:10.1109/icept.2009.5270702

Cited by 56 publications

(34 citation statements)

References 19 publications

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“…The nanoparticle ink is placed in the ultrasonic/ pneumatic atomizer, which creates a dense vapor of the ink with droplet sizes of about 1-5 µm that is transferred to the deposition head with the help of a gas flow running through the atomizer towards the deposition head. The mist stream is then focused by a secondary gas flow to form the micro-jet [14,15]. The printed material can be sintered in a programmable oven.…”

Section: Manufacturing Processmentioning

confidence: 99%

Aerosol based direct-write micro-additive fabrication method for sub-mm 3D metal-dielectric structures

Rahman

Renaud

Heo

et al. 2015

J. Micromech. Microeng.

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The fabrication of 3D metal-dielectric structures at sub-mm length scale is highly important in order to realize low-loss passives and GHz wavelength antennas with applications in wearable and Internet-of-Things (IoT) devices. The inherent 2D nature of lithographic processes severely limits the available manufacturing routes to fabricate 3D structures. Further, the lithographic processes are subtractive and require the use of environmentally harmful chemicals. In this letter, we demonstrate an additive manufacturing method to fabricate 3D metal-dielectric structures at sub-mm length scale. A UV curable dielectric is dispensed from an Aerosol Jet system at 10-100 µm length scale and instantaneously cured to build complex 3D shapes at a length scale <1 mm. A metal nanoparticle ink is then dispensed over the 3D dielectric using a combination of jetting action and tilted dispense head, also using the Aerosol Jet technique and at a length scale 10-100 µm, followed by the nanoparticle sintering. Simulation studies are carried out to demonstrate the feasibility of using such structures as mm-wave antennas. The manufacturing method described in this letter opens up the possibility of fabricating an entirely new class of custom-shaped 3D structures at a sub-mm length scale with potential applications in 3D antennas and passives.

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Section: Manufacturing Processmentioning

confidence: 99%

Aerosol based direct-write micro-additive fabrication method for sub-mm 3D metal-dielectric structures

Rahman

Renaud

Heo

et al. 2015

J. Micromech. Microeng.

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“…These techniques typically build 2D or 2.5D structures in a serial manner and can be classified as a form of microadditive manufacturing [10]. There are numerous reviews of directwrite techniques [11][12][13][14] and comparisons of their advantages and drawbacks are made in [10,11]. Some of the maskless techniques that are droplet-or filament-based include inkjet, microdispensing, and aerosol jet.…”

Section: Introductionmentioning

confidence: 99%

Spatially modulated laser pulses for printing electronics

et al. 2015

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The use of a digital micromirror device (DMD) in laser-induced forward transfer (LIFT) is reviewed. Combining this technique with high-viscosity donor ink (silver nanopaste) results in laser-printed features that are highly congruent in shape and size to the incident laser beam spatial profile. The DMD empowers LIFT to become a highly parallel, rapidly reconfigurable direct-write technology. By adapting half-toning techniques to the DMD bitmap image, the laser transfer threshold fluence for 10 μm features can be reduced using an edge-enhanced beam profile. The integration of LIFT with this beam-shaping technique allows the printing of complex large-area patterns with a single laser pulse.

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“…are required to realize design features. Ink‐jet printing has emerged as an alternate method of directly creating the desired design features, however, variability in droplet sizes limit minimum feature sizes (~20 μm) . In this work, a direct writing technology, Aerosol Jet printing, has been used.…”

Section: Introductionmentioning

confidence: 99%

“…Ink-jet printing has emerged as an alternate method of directly creating the desired design features, 16,17 however, variability in droplet sizes limit minimum feature sizes (~20 lm). 18 In this work, a direct writing technology, Aerosol Jet printing, has been used. Aerosol Jet printing (Optomec, Inc., Albuquerque, TX) is a maskless, CAD driven, noncontact printing technique to deposit particle inks such as the PZT inks used in this research.…”

Section: Introductionmentioning

confidence: 99%

Photonic Sintering of Aerosol Jet Printed Lead Zirconate Titanate (PZT) Thick Films

et al. 2016

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Lead Zirconate Titanate (PZT) is a commonly used piezoelectric material due to its high piezoelectric response. We demonstrate a new method of printing and sintering micro-scale PZT films with low substrate temperature increase. Self-prepared PZT ink was Aerosol-Jet printed on stainless steel substrates. After drying for 2 h in vacuum at 200°C, the printed PZT films were divided into two groups. The first group was traditionally sintered, using a thermal process at 1000°C for 1 h in an Argon environment. The second group was photonically sintered using repetitive sub-msec pulses of high intensity broad spectrum light in an atmospheric environment. The highest measured substrate temperature during photonic sintering was 170.7°C, enabling processing on low melting point substrates. Ferroelectric measurements were performed with a low-frequency sinusoidal signal. The remanent polarization (P r ) and coercive field (E c ) for thermally sintered PZT film were 17.1 lC/cm 2 and 6.3 kV/cm, respectively. The photonically sintered film had 32.4 lC/cm 2 P r and 6.7 kV/cm E c . After poling the samples with 20 kV/cm electric field for 2 h at 150°C, the piezoelectric voltage constant (g 33 ) was measured for the two film groups yielding -16.9 3 10 -3 (VÁm)ÁN -1 (thermally sintered) and -17.9 3 10 -3 (VÁm)ÁN -1 (photonically sintered). Both factors indicate the PZT films were successfully sintered using both methods, with the photonically sintered material exhibiting superior electrical properties. To further validate photonic sintering of PZT on low melting point substrates, the process and measurements were repeated using a polyethylene terephthalate (PET) substrate. The measured P r and E c were 23.1 lC/cm 2 and 5.1 kV/cm, respectively. The g 33 was -17.3 3 10 -3 (VÁm)ÁN -1 . Photonic sintering of thick film PZT directly on low melting point substrates eliminates the need for complex layer transfer processes often associated with flexible PZT transducers.

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Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies

Cited by 56 publications

References 19 publications

Aerosol based direct-write micro-additive fabrication method for sub-mm 3D metal-dielectric structures

Aerosol based direct-write micro-additive fabrication method for sub-mm 3D metal-dielectric structures

Spatially modulated laser pulses for printing electronics

Photonic Sintering of Aerosol Jet Printed Lead Zirconate Titanate (PZT) Thick Films

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