Printed Electronics has emerged as an important fabrication technique that overcomes several shortcomings of conventional lithography and provides custom rapid prototyping for various sensor applications. In this work, silver microelectrode arrays (MEA) with three different electrode spacing were fabricated using 3-D printing by the aerosol jet technology. The microelectrodes were printed at a length scale of about 15 μm, with the space between the electrodes accurately controlled to about 2 times (30 μm, MEA30), 6.6 times (100 μm, MEA100) and 12 times (180 μm, MEA180) the trace width, respectively. Hydrogen peroxide and glucose were chosen as model analytes to demonstrate the performance of the MEA for sensor applications. The electrodes are shown to reduce hydrogen peroxide with a reduction current proportional to the concentration of hydrogen peroxide for certain concentration ranges. Further, the sensitivity of the current for the three electrode configurations was shown to decrease with an increase in the microelectrode spacing (sensitivity of MEA30: MEA100: MEA180 was in the ratio of 3.7: 2.8: 1), demonstrating optimal MEA geometry for such applications. The noise of the different electrode configurations is also characterized and shows a dramatic reduction from MEA30 to MEA100 and MEA180 electrodes. Further, it is shown that the response current is proportional to MEA100 and MEA180 electrode areas, but not for the area of MEA30 electrode (the current density of MEA30 : MEA100 : MEA180 is 0.25 : 1 : 1), indicating that the MEA30 electrodes suffer from diffusion overlap from neighboring electrodes. The work thus establishes the lower limit of microelectrode spacing for our geometry. The lowest detection limit of the MEAs was calculated (with S/N = 3) to be 0.45 μM. Glucose oxidase was immobilized on MEA100 microelectrodes to demonstrate a glucose biosensor application. The sensitivity of glucose biosensor was 1.73 μAmM-1 and the calculated value of detection limit (S/N = 3) was 1.7 μM. The electrochemical response characteristics of the MEAs were in agreement with the predictions of existing models. The current work opens up the possibility of additive manufacturing as a fabrication technique for low cost custom-shaped MEA structures that can be used as electrochemical platforms for a wide range of sensor applications.
The fabrication of 3D metal-dielectric structures at sub-mm length scale is highly important in order to realize low-loss passives and GHz wavelength antennas with applications in wearable and Internet-of-Things (IoT) devices. The inherent 2D nature of lithographic processes severely limits the available manufacturing routes to fabricate 3D structures. Further, the lithographic processes are subtractive and require the use of environmentally harmful chemicals. In this letter, we demonstrate an additive manufacturing method to fabricate 3D metal-dielectric structures at sub-mm length scale. A UV curable dielectric is dispensed from an Aerosol Jet system at 10-100 µm length scale and instantaneously cured to build complex 3D shapes at a length scale <1 mm. A metal nanoparticle ink is then dispensed over the 3D dielectric using a combination of jetting action and tilted dispense head, also using the Aerosol Jet technique and at a length scale 10-100 µm, followed by the nanoparticle sintering. Simulation studies are carried out to demonstrate the feasibility of using such structures as mm-wave antennas. The manufacturing method described in this letter opens up the possibility of fabricating an entirely new class of custom-shaped 3D structures at a sub-mm length scale with potential applications in 3D antennas and passives.
Deformable temperature sensors are required for applications such as soft robotics, biometric sensing, cryopreservation of organs, and flexible electronics. In this paper, we demonstrate Cu–CuNi temperature sensors on flexible Kapton substrates by a novel method consisting of rapid aerosol jet printing of nanoparticles followed by laser sintering at low powers of 100 mW and 400 mW under a shroud of an inert gas to minimize oxidation. The sensors showed a highly linear response as a function of the temperature and the highest sensitivity among film-based sensors yet reported in literature (RajagopalM. C. Rajagopal, M. C. Sens. Actuators, A2018272253; YangF. Yang, F. Sci. Rep.201771721; MurakamiR. Murakami, R. J. Cryst. Growth20184877277). The sensor film microstructure was investigated using scanning electron microscopy (SEM), X-ray photoemission spectroscopy (XPS), transmission electron microscopy (TEM), and selective area electron diffraction (SAED). The Cu and CuNi film morphology consisted of fused nanoparticles with varying degrees of coalescence and porosities ranging from 9% to 24% through the thickness of the films. No surface oxidation was observed for CuNi films but oxide phase was detected for the Cu films, which did not affect the sensor performance after repeated tests up to a temperature of 140 °C. The sensor performance was independent of the manufacturing conditions of the aerosol jet printing process. Flexibility tests showed a stable device performance (variation of Seebeck coefficient within 2.5%) after 200 bending cycles at three different radii and 200 twisting cycles. The superior performance of the sensor films to the bending and twisting tests was attributed to the porosity of the sintered nanoparticles that allows significant strain without a proportional build-up of the stresses in the film. These results demonstrate the suitability of nanoparticle-based bottom-up fabrication methods for a range of deformable high-performance electronic devices.
Printed electronics has emerged as a versatile eco-friendly fabrication technique to create sintered nanoparticle (NP) films on arbitrary surfaces with an excellent control over the film microstructure. While applicability of such films for high-temperature applications is not explored previously, herein we report the high-temperature electrical stability of silver (Ag) metal NP films fabricated using an Aerosol Jet based printing technique and demonstrate that this behavior is dictated by changes in the film microstructure. In-situ high temperature (24-500 C) impedance spectroscopy measurements show that the real part of the impedance increases with increasing temperature up to 150 C, at which point a decreasing trend prevails until 300 C, followed again by an increase in impedance. The electrical behavior is correlated with the in-situ grain growth of the Ag NP films, as observed afterwards by scanning electron microscopy and X-ray diffraction (XRD), and could be tailored by controlling the initial microstructure through sintering conditions. Using combined diffraction and spectroscopic analytical methods, it is demonstrated the Aerosol Jet printed Ag NP films exhibit enhanced thermal stability and oxidation resistance. In addition to establishing the conditions for stability of Ag NP films, the results provide a fundamental understanding of the effect of grain growth and reduction in grain boundary area on the electrical stability of sintered NP films. Published by AIP Publishing. [http://dx.
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