Spatially modulated laser pulses for printing electronics

Auyeung, R. C. Y.; Kim, Heung Soo; Mathews, Scott A.; Piqué, Alberto

doi:10.1364/ao.54.000f70

Cited by 16 publications

(10 citation statements)

References 35 publications

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“…In general, the higher the laser spatial uniformity is, i.e., non‐Gaussian, the better the congruent transfers. Given the strong dependence for size, shape and thickness of the transferred voxel to the laser fluence threshold, the use of custom spatial laser beam profiles (as those produced with spatial light modulators) for transferring patterns of arbitrary shape and size at various resolutions have met with great success and are expected to streamline the implementation of congruent LIFT …”

Section: Lift From Liquid Donor Filmsmentioning

confidence: 99%

Laser‐Induced Forward Transfer: Fundamentals and Applications

Serra

Piqué

2018

Adv Materials Technologies

Self Cite

255

191

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Laser‐induced forward transfer (LIFT) is a digital printing technique that uses a pulsed laser beam as the driving force to project material from a donor thin film toward the receiving substrate whereon that material will be finally deposited as a voxel. This working principle allows LIFT to operate with both solid and liquid donor films, which provides the technique with an unprecedented broad spectrum of printable materials, and thus makes it very competitive over other digital technologies, like inkjet printing. It is not only that LIFT can access a much wider range of ink viscosities and loading particle sizes; the possibility of printing from solid films allows the single‐step printing of multilayers and entire devices, and even makes possible 3D printing. This versatility translates, in turn, into a broad field of applications, from graphics production to printed electronics, from the fabrication of chemical sensors to tissue engineering. This monograph provides an extensive review of the LIFT technique, from its origins to the most recent achievements, focusing on the fundamental aspects of both its working principle and transfer dynamics, as well as on its broad range of applications.

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Section: Lift From Liquid Donor Filmsmentioning

confidence: 99%

Laser‐Induced Forward Transfer: Fundamentals and Applications

Serra

Piqué

2018

Adv Materials Technologies

Self Cite

255

191

View full text Add to dashboard Cite

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Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

“…Another remarkable progress is that complex structures can be printed in a single step, with the help of the changeable profile of the laser pulse by using spatial light modulators . The spatial light modulator, also known as the digital micromirror device (DMD), can transform a laser beam to an arbitrary shape.…”

Section: Laser‐assisted Printing Techniquesmentioning

confidence: 99%

“…Images reproduced with permission: “SUFTLA,” copyright 2018 WILEY‐VCH. “EPLaR,” copyright 2014 Taylor & Francis Inc. “tmSLADT,” “LMTP,” “Ultrathin Soft Neural Probes,” copyright 2014, 2015, 2015, respectively, Elsevier, “Laser‐Assisted Rapid Dry Transfer for VACNTs,” “Laser Multiscanning (LMS) Lift‐off,” “Flexible TEGs,” “Flexible Free‐Standing LED,” copyright 2012, 2016, 2016, 2016, respectively, American Chemical Society, “One Step LIFT Multilayer Stack in Solid Phase,” copyright 2013, AIP Publishing, “LIFT Using Structured Light,” “Super Flexible Green ILEDs,” copyright 2015, 2018, respectively, OSA Publishing, “Injectable Cellular‐scale Semiconductor Devices,” copyright 2013, American Association for the Advancement of Science, “Inorganic‐Based Laser Lift Off,” “Laser‐Driven Memory Effect for Transfer Printing,” “Laser Printing of Bioresorbable Conductor,” “LLO for Micro‐LED Assembly,” “EPLaR OLED Lamp,” “SUFTLA in Flexible EPD,” “LLO for µ‐ILEDs,” “PZT Thin Film Nanogenerator,” “Resistive Memory Arrays,” “Skin‐Like OTFT Displays,” “Self‐powered Conformal Pulse Sensor,” “GaN Blue f‐VLED Array,” Copyright 2014, 2016, 2017, 2018, 2005, 2007, 2012, 2014, 2014, 2016, 2017, 2018, respectively, WILEY‐VCH.…”

Section: Introductionmentioning

confidence: 99%

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Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Bian

Zhou

Wan

et al. 2019

Adv Elect Materials

104

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materials and enable innovative applications that are hard to achieve with current microelectronics. Examples vary from biointegrated devices for clinical diagnosis and treatment, [11][12][13] to electronic skin (E-Skin), [14][15][16] energy harvesting/storage devices, [17][18][19][20][21] and sweat sensor, [22,23] to flexible display, [24,25] and to RFID tags, [26,27] etc.Two main kinds of microfabrication processes have been developed for flexible electronics, including the solutionprocessable methods and vacuum-based methods (lithographic patterning and undercut etching). [28] The former is naturally compatible with flexible substrates and can deposit and pattern functional materials in one single step. [29][30][31] They have fabricated various printed electronics with increasing performance, such as conductive metal wires, [32][33][34] thin film transistors (TFTs), [35][36][37] and piezoelectric devices. [38][39][40][41] However, the electronic performance is still limited by the properties of solution-processable functional materials and low resolution of printing techniques, with respect to standard microfabrication process. [42] On the other side, vacuum-based microfabrication techniques provide wellestablished routes to realize high-performance electronics, but generally incompatible with large-area, flexible (polymeric substrates). Ideally, high performance flexible electronics systems are usually fabricated by built-up process that begins with independent fabrication of high-modulus, fragile, chip-scale elements (e.g., IC chips, MEMS, sensors, and power sources) or flexible devices (e.g., flexible sensor, flexible display, and TFT array) on donor wafers, followed by being transferred onto flexible/stretchable substrates.The above manufacturing routes of flexible electronics can be concluded as the transfer of the materials, components, and devices from original fabricated/prepared substrates to flexible ones. The most significant built-in challenge in transferring is to control of interface status to accommodate to the disparate nature of the transferred objects from donor wafer/substrate. Distinctive assembly techniques based on stress-induced interface fracture have been invented to be adaptive to the diversity of material properties and geometric sizes that lead to tremendous differences in mechanical properties. For those conventional rigid electronic components like IC chips, they are transferred by standard single-ejector needle pick-and-place It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible subst...

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“…[ 25–32 ] In contrast to IJP, the absence of nozzle sets almost no restriction on the rheological properties of the ink. Several studies have proved the feasibility of LIFT for printing liquids with a wide range of viscosities (from 1 to 10 6 mPa s), [ 33–35 ] and suspensions containing large loading particles (up to 30 µm). [ 36–38 ] Thus, SP inks—with high viscosity (>10 Pa s) and usually loaded with large particles (a few micrometers)—can be printed using LIFT, [ 39–43 ] though not through IJP.…”

Section: Introductionmentioning

confidence: 99%

Laser‐Induced Forward Transfer: A Digital Approach for Printing Devices on Regular Paper

Sopeña

Sieiro

Fernández-Pradas

et al. 2020

Adv Materials Technologies

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Inkjet printing (IJP) is the most widespread direct‐write technique in paper electronics. However, this technique cannot be used for printing devices on untreated regular paper, since its low‐viscosity nanoinks leak through the cellulose fibers. Thus, a planarization coating is frequently used as a barrier, even though this makes substrates more expensive and less eco‐friendly. Alternatively, high solid content screen printing (SP) inks could allow printing on regular paper due to their high viscosity and large particle size; however, they cannot be printed through IJP. Another digital technique is then required: laser‐induced forward transfer (LIFT). This work aims at proving the feasibility of LIFT for printing devices on regular paper. The main transfer parameters are systematically varied to obtain uniform Ag‐SP interconnects, whose performance is improved by a multiple‐printing approach. It results in low resistances with much better performance than those typical of IJP. After optimizing the functionality of the printed lines, a proof‐of‐concept consisting of a radio‐frequency inductor is provided. The characterization of the device shows a substantially higher performance than that of the same device printed with IJP ink in similar conditions, which proves the potential of LIFT for digitally fabricating devices on regular paper.

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Spatially modulated laser pulses for printing electronics

Cited by 16 publications

References 35 publications

Laser‐Induced Forward Transfer: Fundamentals and Applications

Laser‐Induced Forward Transfer: Fundamentals and Applications

Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics

Laser‐Induced Forward Transfer: A Digital Approach for Printing Devices on Regular Paper

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